Search results for "chips"

Nexcom has launched a powerful new Fan-less Industrial computer system which is targeted at PoE and/or Mobile DVR applications. Based on the Mobile Intel® GM45 Express chipset, NISE 3144 is a PoE enabled computer system which provides 4 x PoE interfaces for connection to a wide variety of Class 3 PoE enabled devices such as VoIP, IP Camera, wire-less access point and RFID reader.

Nexcom has launched two new embedded boards which are based on the Computer On Module (COM Express) form factor, a format which reduces the design cycle lead times and provides other benefits such as trouble-free maintenance, installation and upgrades.

NISE 101 is a fan-less industrial computer system, which supports a multitude of I/O interfaces including RS232, RS232/422/485, LAN (x2), USB (x 2) PS/2; as well as VGA and DVI-D display output. Based on the Intel Atom based N270 1.6GHZ processor and 945GSE embedded chipset, NISE 101 fanless PC is a lightweight, energy-efficient platform which boasts the necessary features and characteristics required for non-stop operation even in industrial en...

LynuxWorks, Inc. will be premiering its latest secure virtualization technology and high performance safety critical software at MILCOM in San Jose, CA, October 31- November 3, 2010. Both the LynxSecure virtualization technology, designed to meet the highest levels of security certification, and the LynxOS-178 safety critical real-time operating system (RTOS), certified to DO-178B level A, will be demonstrated live on real-world systems in the L...

QuickLogic is showcasing the design flexibility that is enabled by its Customer Specific Standard Product (CSSP) technology during Mobile World Congress, by showing real-life OEM/ODM products and demonstration systems. Some of the consumer and prosumer products on display include:

STMicroelectronics and Alango Technologies Ltd, a leading developer and licensor of front-end voice enhancement technologies, today announced a licensing agreement in which ST will integrate Alango’s leading software technologies into ST’s advanced Bluetooth chips for car infotainment applications, such as hands-free kits. Automotive analysts currently forecast that approximately 45% of new cars will be equipped with hands-free equipment by 2...

To meet the widespread global demand for DOCSIS 3.0® (Data Over Cable Service Interface Specification) products and services, Texas Instruments Incorporated’s Israeli engineering team is creating innovative cable modem, set-top-box and video gateway chipsets that help operators and manufacturers deliver blazing data transfer speeds and compelling multimedia services. TI’s world-class lab, located in Herzelia, Israel, allows TI to deliver nex...

Texas Instruments has announced its Consumer Electronics WLAN Developer Kit (CE WLAN DK) 2.0. which provides manufacturers with the systems-level building blocks they need to add Wi-Fi connectivity to battery-operated devices from digital still cameras and portable media players (PMPs) to emerging communications and entertainment applications.

HONOLULU - Before the start of the prestigious 2006 Symposium on VLSI Technology, Texas Instruments unveiled details of a 45-nanometer semiconductor manufacturing process that leverages a "wet" lithography process to double the number of chips produced on each silicon wafer, increase processing performance and reduce power consumption. Through the use of numerous proprietary techniques, TI will drive the capabilities of its multi-million tra...

Continually expanding its efforts to drive innovation, creativity and invention, Texas Instruments Incorporated (TI) (NYSE: TXN) will showcase the latest products that are impacting modern lifestyles at the 2007 International Consumer Electronics Show (CES), January 8-11, at the Las Vegas Convention Center, booth #8204.