Search results for "thermal"

The latest power products from Analog Devices (ADI) are now in stock at Farnell. These newly introduced power management ICs and converters are engineered to meet stringent power requirements.

The CSI series shunt resistors from Bourns feature a low temperature coefficient of resistance (TCR) for operating accuracy over wide temperature ranges and excellent long-term stability.

As power electronics evolve, the requirements for high current, low resistance sensing resistors continues to increase.

The Chomerics Division of Parker Hannifin Corporation has announced its new THERM-A-GAP PAD 80 high-performance gap filler pad is now available.

The Chomerics Division of Parker has announced its new THERM-A-GAP PAD 80 high-performance gap filler pad is now available.

Infineon has launched the TDA388xx family, targeting the server, AI, datacom, telecom, and storage markets.

Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.

Hexagon’s Manufacturing Intelligence division and JSOL Corporation have entered a strategic partnership to accelerate the virtual prototyping of electrified powertrains through multi-physics simulation.

Panasonic Industry has launched a new member of its Grid-EYE sensor family featuring a 90° lens delivering a wider FoV and reducing the number of sensors required to cover a given area to enable people counting and tracking applications.

With its Power+Board system solutions, Bicker Elektronik offers all components from a single source: latest industrial motherboards from ASUS IoT for the 13th generation Intel Core, suitable power supply and UPS solutions, as well as industrial-quality memory and accessories.