Search results for "thermal"

Fellten, known for its innovation in vehicle electrification, recently unveiled details of its partnership with Morgan Motor Company.

NeoGraf Solutions, a developer and manufacturer of high-performance natural and synthetic graphite sheet and powder, has announced a multi-pronged effort to ensure uninterrupted supply of its graphite materials in response to China’s recent decision to impose controls on some exports of graphite.

As the pioneers of copper-clip packaging technology, Nexperia bring20 years’ expertise in high-quality, robust SMD packaging to itsGaN FET portfolio. Adopting proven technology, CCPAK gives industry-leading performance in an innovative package. The copper-clip, cascode designoptimizes thermal and electrical performance making them ideal to meet the demands of next-generation industrial and renewable energy applications.

Ambarella, an edge AI semiconductor company, has announced its autonomous driving (AD) software stack, which is primarily based on deep learning AI processing for all of its modular components, including environmental perception, sensor fusion, and vehicle path planning.

Advantest will feature its latest test solutions at SEMICON Japan 2023 at the Tokyo Big Sight (December 13-15).

Nexperia has announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications.

In the realm of heat transfer, thermal energy is conveyed by quantum particles known as phonons. However, at the nanoscale relevant to today's advanced semiconductors, phonons aren't sufficient for effective heat removal. Therefore, Purdue University researchers are exploring a novel approach by employing hybrid quasiparticles called ‘polaritons’ to enhance this process.

Advantest Corporation announced two new products designed to deliver advanced handling capabilities essential for the fast-growing AI and high-performance computing (HPC) markets: the HA1200 die-level handler and the active thermal control (ATC) 2-kilowatt (kW) option for the M487x handler series.

Vishay Intertechnology has introduced five new series of 60, 100, and 150V surface-mount Trench MOS Barrier Schottky (TMBS) rectifiers in the low profile DFN3820A package with wettable flanks.

A new sensor solution for detecting A2L refrigerant leaks in residential and commercial air conditioning systems, heat pumps, and refrigeration equipment has been released by Posifa Technologies.