Search results for "miniaturisation"
Silicon chips get a boost as Chiral raised $3.8m
Nanotechnology firm Chiral announced it has secured $3.8 million in funding, pioneering the integration of nanomaterials into electronic devices.
IDTechEx explores new developments in EMI shielding
Electromagnetic interference (EMI) shielding is adapting to meet the demands of evolving communications technology.
StenTech introduces chemical vapor deposition surface treatment for SMT stencils
StenTech has announced the launch of its groundbreaking stencil coating technology, the StenTech BluPrint CVD (Chemical Vapor Deposition) Surface Treatment, aimed at advancing the Surface Mount Technology (SMT) processes.
Back flip FPC/FFC connector from Hirose
Hirose has expanded its back flip FPC/FFC connector offering to include a 0.5 mm pitch version that offers dual contact functionality to simplify flex routing.
Secure thermal digital twin technology for the electronics supply chain
Siemens Digital Industries Software has recently announced its introduction of a novel method for distributing precise thermal models of integrated circuit (IC) packages throughout the electronics supply chain.
XENSIV linear TMR sensor: precision length measurement
Infineon Technologies combines its expertise in magnetic position sensors with its linearised tunnel magnetoresistance (TMR) technology to launch the XENSIV TLI5590-A6W magnetic position sensor.
ABLIC introduces S-19954/5 Series
ABLIC has launched the S-19954/5 Series, a new line of automotive step-down switching regulators.These regulators operate at 5.5V with a 1A output and are noted for being housed in the smallest package in the industry, measuring just 1.6 x 1.6 x t0.41mm (HSNT-8(1616)B package).
Infineon launch new magnetic position sensor XENSIV TLI5590-A6W
Infineon has announced the launch of its new magnetic position sensor, the XENSIV TLI5590-A6W. This sensor, featuring a wafer-level package, is designed for both linear and angular incremental position detection.
EM Microelectronic's em|bleu: new Bluetooth 5.4 benchmark
In an era where technology races towards miniaturisation with increased integration and minimum power consumption, the demand for more compact, energy-efficient devices with no compromise on performance has never been higher.
Non-metallic materials to shape emerging connector manufacturing processes
Advances in non-metallic (organic) materials science will undoubtedly drive the future of commercial, military, and aeronautic electronic interconnect materials and plating.