Search results for "Toshiba"
Ethernet AVB chipset enables infotainment & telematics
Designed to reliable multimedia transmissions for next-gen infotainment and telematics, Toshiba Electronics Europe has introduced an automotive-grade Ethernet bridge solution. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE 802.1Qav, generally referred to as Ethernet-AVB.
15nm eMMC NAND Flash targets automotive applications
Toshiba Electronics Europe announces a range of 15nm eMMC (embedded MultiMediaCard) NAND Flash memory for automotive infotainment and industrial applications. Available in an 11.5x13mm package that is fully compliant with the latest JEDEC eMMC standard, Toshiba’s 15nm eMMC chips are among the world's smallest.
Sensor technologies are mature for autonomous driving application
Autonomous driving is arguably the most exciting development in the industry today. Indeed, according to the latest analysis from Yole Développement (Yole), entitled Sensors and Data Management for Autonomous Vehicles report 2015 (October 2015 edition), the automotive market segment is the next target of the consumer electronic players.
The top 10 semiconductor R&D spenders in 2015
Semiconductor industry spending on R&D grew by just 0.5% in 2015, which was the smallest increase since the 2009 downturn year and significantly below the CAGR of 4.0% in R&D expenditures during the last 10 years, according to IC Insights’ 2016 edition of The McClean Report.The 0.5% increase nudged worldwide R&D spending by semiconductor companies to a new record-high level of $56.4bn in 2015 from the previous peak of $54.1bn in...
ELEXCON 2016 to showcase latest technology developments
ELEXCON 2016 will be held in Shenzhen at the Shenzhen Convention & Exhibition Center, Hall 2, from August 24thto 26th, 2016. More than 500 exhibitors and 50,000 industry professionals will gather in China's international electronic manufacturing epicenter. To access the event registration page, click here.
Top 10 available wafer fab capacity - December 2015
IC Insights has released its Global Wafer Capacity 2016-2020 report that provides in-depth detail and analysis of IC industry capacity by wafer size, process geometry, region and product type. The report provides a ranking of the industry’s 25 largest IC manufacturers in terms of installed capacity as of December 2015. The top 10 capacity leaders are shown in Figure 1.
Power IC enables designs to meet ASIL-D requirements
Toshiba Electronics Europe has launched a general purpose system power IC housed in an HTSSOP48-P-300-0.50 package measuring 6.1x12.5x1.0mm. Safety-critical automotive systems, such as Electric Power Steering (EPS) and braking, are required to meet the requirements of ASIL-D: the highest automotive safety integrity level prescribed in the ISO 26262 functional safety standards.
microSD cards are water-, shock-, temperature- & x-ray proof
Designed for action cameras and mobile devices for high-action sports and adventure enthusiasts, high speed microSDHC and microSDXC cards have been announced by Toshiba Electronics Europe. The water, shock and x-ray proof EXCERIA PRO M401 microSD cards operate over a temperature range from -25 to +85°C and can safely store data at temperatures from -40 to +85°C.
Small package microcontroller with pre-driver
The TX03 series of ARM Cortex-M3-based microcontrollers from Toshiba Electronics Europe, has been extended with the introduction of the TMPM37AFSQG – a new IC that incorporates Toshiba’s Vector Engine Plus (VE+) coprocessor and a pre-driver to enable brushless DC motor control.The TMPM37AFSQG pre-driver can directly drive MOSFETs for complementary 3-phase PWM output with a minimum unit of 25ns.
Receiver IC promises faster wireless charging
Toshiba Electronics Europe has announced the launch of the industry’s first single-chip 15W wireless power receiver IC that is compliant with the Qi v1.2 specifications defined by the Wireless Power Consortium (WPC). The TC7766WBG has been designed for use in mobile devices such as smartphones, tablets and a range of mobile industrial devices.