Search results for "Toshiba"

Toshiba Electronics Europe has announced the development of a next gen TarfSOI (Toshiba advanced RF SOI) process optimised for RF switch applications. RF switch ICs, fabricated using the new TaRF8 process such as the SP12T1 process, achieve the lowest-class of insertion loss in the industry. Sample shipments of SP12T RF switch ICs fabricated with the new process will start in January 2016.

Aimed for use in wearable devices, healthcare devices, smart phone accessories, sensors, remote controllers, beacons and toys, Toshiba Electronics Europe’s new Bluetooth ICs feature built-in Flash ROM, with one also adding the option of integrated NFC Tag functionality.

Toshiba has launched a photocoupler featuring high speed data transmission (20Mb/s) and a very thin package that offers protection against extreme operating temperatures.The TLP2768A integrates a high-reliability infrared LED in its input side, and has an open-collector output type high-speed Photo-IC in its output side that is capable of data transmission at 20Mbps and of supporting both 3.3V and 5V power supplies.

Toshiba Corporation, hereby gives notice of policy decisions, as described below, in respect of the Company’s System LSI business and Discrete semiconductor business, part of the Semiconductor business. These decisions are a part of a fundamental restructuring that is being undertaken by the Company.

At the IEEE IEDM conference last week, imec showed the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm. The new channel material improves transconductance and read current which is crucial to enable further VNAND cost reduction by adding additional layers in 3D vertical architecture.

Toshiba and SanDisk have announced the start of equipment installation in the New Fab 2 facility at Yokkaichi Operations. New Fab 2 is primarily intended to provide the clean room space necessary to transition a significant portion of the current Yokkaichi 2D NAND capacity to 3D flash memory. The companies also signed definitive agreements for joint manufacturing of 3D flash memory and investment in New Fab 2.

Toshiba Electronics Europe has announced its latest enterprise performance HDD line, the AL14SE series, designed for mission critical servers and high-performance, high-availability storage systems. The AL14SE is Toshiba’s latest 10,500rmp HDD to support 12.0Gb/sSAS and 512n sector length for compatibility with the latest generation host controllers and host bus adapters.

A line-up of 24nm SLC NAND flash memory products for embedded applications that are compatible with the widely used Serial Peripheral Interface (SPI) has been unveiled by Toshiba Electronics Europe. Wide ranging applications for the Serial Interface NAND include consumer applications such as flat-screen TVs, printers, wearables and industrial applications including industrial robots.

Swissbit has introduced F-60/F-600 CFast 2.0 compatible cards delivering superior performance of up to 70,000IOPS random read/write or 525MB/s sequential read and 350MB/s sequential write.The F-60 cards are the first in the market to feature the latest Toshiba 15nm MLC-NAND technology, which enables advanced performance and extended lifecycle. The F-600 series featuring 24nm SLC-NAND is also available.

Expanding the company's ARM Cortex-M0 core based TX00 series, Toshiba Electronics Europe has launched three MCUs optimised for use in USB devices. The TMPM066FWUG, TMPM067FWQG and TMPM068FWXBG feature integrated USB controllers, 128Kb of Flash memory, 16Kb of SRAM and have been designed for use in mobile device applications, such as tablets, laptop PCs, office automation equipment, industrial controllers and sensor hubs.