Search results for "Toshiba"

On its 15th birthday, electronica China closed successfully, breaking records across the board and providing unparalleled opportunities for companies big and small to launch innovations to the Asian market. 1,088 exhibitors from 31 countries showcased at both trade fairs—electronica China and productronica China—their latest technologies across 62,000 square meters of exhibition space this week.

Designed for comms applications in factory automation equipment and home appliances, Toshiba Electronics Europe has announced the TLP2703 photocoupler. The device supports signal transfer speeds of up to 100kb/s, can be driven by a low input current of just 1mA and is price competitive with 1Mb/s class IC photocouplers.

Toshiba Electronics Europe has launched two high speed photocouplers, TLP2745 and TLP2748. The company's latest IC output photocouplers feature low Pulse Width Distortion (PWD) and low power consumption for high speed, high temperature operation.

Five years down the line, after the Fukushima nuclear power plant meltdown, and the halls of reactor 3’s building are still racked with radiation. Although clean-up efforts have already helped to contain some radioactive material, the plant’s manager still estimates there’s another 30 to 40 years before a full decommissioning.

Optimised for read-intensive application workloads such as data warehousing, web servers, media streaming and video on demand, Toshiba Electronics Europe has announced a series of very read-intensive, enterprise SAS SSDs. The PX04SL seriesassists organisations in minimising TCO without sacrificing performance and is available in 2 and 4TBcapacities.

The new PAN1760 Series Bluetooth Smart module v4.1 with integrated antenna and embedded GATT profile is a cost-effective, low-power, true system-on-chip (SoC) solution. This nanopower module for the Internet of Things, launched by Panasonic Automotive & Industrial Systems, is available at distributor Rutronik.

embedded world, taking place in the Nuremberg Exhibition Centre from 23rd-25th February 2016, will once again be supporting the efficiency and innovative strength of the global embedded industry. The central objectives of the conferences are to provide specifically targeted knowledge, to highlight trends and current themes, to offer a glimpse into the future and to facilitate a dialogue between experts. Electronic Specifier Editor Joe Bush takes ...

Panasonic Automotive & Industrial Systems has announced a next-gen Bluetooth Smart module v4.1 with integrated antenna and embedded GATT profile. Designed for the IoT, the PAN1760 series is a cost-effective, low-power, true SoC solution for low energy Bluetooth applications such as data transfer to smartphones/tablets, wireless health monitoring, smart home, general industry and portable applications without host MCU.

At SPIE Advanced Lithography Conference (San Jose, Feb 21-25th), imec will present electrical results of DSA (directed self-assembly)-formed vias, gaining insight in the impact of DSA processing variations on electrical readout.

Expanding its line up of ApP Lite application processors for wearable devices and the IoT, Toshiba Electronics Europe has announced the TZ1201XBG. This latest addition to the TZ1000 series is based on a high performance 32-bit ARM Cortex-M4F RISC processor capable of operating at frequencies of up to 120MHz.