Search results for "ASIC"
Fully encapsulated dual power modules offers high power density
Renesas Electronics has announced two new fully encapsulated digital DC/DC PMBus power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to 95.5% peak efficiency in a compact 18x23mm2 footprint.
Memory solution supports AI automotive and networking applications
The new GDDR6 (Graphics Double Data Rate) Memory PHY IP Core has been announced by Rambus, which is targeted for high-performance applications including cryptocurrency mining, artificial intelligence (AI), ADAS (advanced driver assistance systems) and networking.
Fully integrated SVID and PVID enables voltage regulator efficiency
The latestIntegrated Point-of-Load (IPOL) family has been announced by Infineon Technologies. Itcombines ease of use with high power density. According to the company, it is the industry’s first fully integrated regulator offering PMBUS, SVID and PVID functionality for powering Intel CPU POL rails, chipsets and ASIC/FPGA. With 50% space saving compared to alternative external power solutions, this is the smallest solution size of its class.
The latest low-profile phased antenna for a mobile world
The EU-funded PHASOR project is disrupting the mobile communications market with the world’s first cost-effective, electronically steerable, digital, low-profile phased antenna.Today’s communications infrastructure is incapable of keeping up with society’s demand for faster, more mobile data traffic.
Duo collaborate on automotive wireless charging
A collaboration has been announced betweenON Semiconductor and ConvenientPower Systems (CPS) whereby CPS will design, develop and market in-vehicle wireless charging solutions using ON Semiconductor’s NCV6500 application dedicated, power management controller.The combined initiative is based around a single architecture that is scalable for multiple devices and coils to 15W.
The future lies within industrial solution enhancements for Renesas
At the SPS Drives show in Nuremberg which took place last month, Renesas Electronics announced the availability of the new RZ/N1 microprocessor (MPU) Solution Kit designed to support various industrial network applications including programmable logic controllers (PLCs), intelligent network switches, gateways, operator terminals and remote I/O solutions.
A fusion of sensor technology enhances the IoMT
The Internet of Moving Things (IoMT) is here. From smartphones and tablets to smart clothing and wearables, everyday objects and devices are now able to measure, monitor and analyse motion, generating massive amounts of data and insight. Electronic Specifier caught up with Ben Lee, CEO of MEMS sensor developer mCube on what the company brings to the market space and an intriguing acquisition.
Five output digital voltage regulator is for multi-rail systems
Available in a QFN package, the IRPS5401 is Infineon Technologies' five output point of load (PoL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems.
A chip designed just for you will give your product the edge
Can a single, multi-function electronic component, designed and produced specifically for a single customer or product, make a major contribution to functionality, performance, size, reliability and overall cost? Without a doubt says Richard Mount of Swindon Silicon Systems.What’s more, incorporating Application Specific Integrated Circuits (ASICs) will make your offering unique while insuring against future component supply issues during t...
High margin products push growth at silicon IP provider
Fabless ASIC service and silicon IP provider Faraday Technology has reported third quarter consolidated revenue of NT$1,269 million, down 16.0% quarter-over-quarter while gross margin reached 52.5%, up five percentage points from the previous quarter. In the third quarter, Faraday’s product mix continued to improve.