Search results for "ASIC"
Manufacturing, test services feature in Nuremberg
Many years ago, ASICs revolutionised the electronics industry by shrinking a PCBA onto a single chip. However, as semiconductor process technology advanced, the cost of making a chip on the newer process nodes increased to the point where companies think it too expensive to consider.
Next-gen transducers achieve offset drift down to 3ppm/°C
The latest closed-loop Hall effect current transducers introduced by LEM deliver the added performance of fluxgate transducers without the added cost.
Peak efficiency and excellent thermal performance
Analog Devices has announced the Power by Linear LTM4662, a dual 15A or single 30A step-down µModule regulator in a BGA package with an exposed stacked inductor for improved thermal dissipation properties. The remaining components, the MOSFETs, DC/DC controller and supporting components, are over-moulded and the complete device is housed in a 11.25mm x 15mm x 5.74mm BGA package.
Supporting customers affected by obsolete microelectronics
Provider of high-temperature and extended lifetime semiconductor solutions, CISSOID, has announced its readiness in supporting customers affected by the Last-Time-Buy (LTB) announcement by Honeywell for its High Temperature Microelectronics Products and releases a cross-reference table for CISSOID equivalent parts, all rated from -55 to 225°C and also available as bare die.
Microsemi reveals its embedded world programme
Semiconductor solutions company,Microsemi, has announced it will be participating at embedded world 2018 in Nuremberg, Germany, from 27th February to 1st March. The company has assembled a group of technical experts to showcase how the company’s solutions, including its Mi-V Embedded Ecosystem, PolarFire field programmable gate array (FPGA) family and RISC-V embedded processor, help application engineers tackle the unique challenges associa...
Addressing IoT chip security with manufacturing test services
The recent Meltdown and Spectre problems have highlighted the vulnerability of computer chips to hacking that can, at least, be addressed through software patches. However, another area that is increasingly a target for hackers is IoT where each node in an IoT network can provide an entry point to a company's corporate systems, in a similar manner to the way that home security cameras, robot vacuum cleaners, have been hacked.
Single-chip custom solutions provide optimised Edge computing
In order to give customers access to cost-optimised, custom single-chip solutions that put performance right at the edge of the IoT,S3 Semiconductors has announced the introduction of its SmartEdge Platform. Processing at the Edge is a rapidly evolving trend that accelerates data analytics at the source and reduces cloud-based processing, delivering more responsive decision making.
Microchip Technology in talks to buy Microsemi
Consolidation in the semiconductor industry looks set to continue with news that Microchip Technology is set to buy Microsemi, per the Wall Street Journal. Talks between the two companies are continuing so no deal has been struck yet.
Design rule checking solution offers expanded capabilities
Electronic design verification company, Aldec, has expanded the rule-checking capabilities of its ALINT-PRO tool in response to growing complexity of large-scale modern FPGA and ASIC designs. Rules new to the 2017.12 release of ALINT-PRO assure the integrity of a design’s Finite State Machines (FSMs) and help identify possible Reset Domain Crossing (RDC) issues.
Dual digital power module delivers PoL conversions
The ISL8274M is an encapsulated dual 30A digital DC/DC PMBus power modules that delivers Point-of-Load (PoL) conversions for advanced FPGAs, DSPs, ASICs and memory used in servers, telecom, datacom, optical networking and storage equipment.