Search results for "ASIC"
EnSilica extends its automotive design and supply services
EnSilica has announced that it is extending its full service of chip design through to volume supply to meet the increasing requirements from the automotive market. To support this, the company has signed a Representative Agreement with Lojixx Technologies, who have many years of experience in the automotive market with market knowledge.
Digital power system enables conversion efficiency monitoring
Analog Devices hasannounced a 2-channel power system manager, the Power by Linear LTC2972 features current, power and energy monitoring of the intermediate bus input to Point-of-Load (PoL) converters. Monitoring circuit board power and energy use is a prerequisite for managing, optimising and reducing their consumption in order to lower server rack and data centre cooling and utility costs.
Fusion tech to transform the RTL-to-GDSII flow
Synopsys, Inc. has unveiled its breakthrough Fusion Technology that transforms the RTL-to-GDSII design flow with the fusion of best-in-class optimisation and industry-golden signoff tools, enabling designers to accelerate the delivery of their next-generation designs with industry-best full-flow quality-of-results (QoR) and the fastest time-to-results (TTR).
EnSilica becomes Arm approved design partner
EnSilica has announced that it has become an Arm Approved Design Partner. The company is experienced in developing digital and mixed signal SoCs and has been integrating third party IP into designs since EnSilica was founded in 2001.
IP offerings for machine vision applications
Microsemi has announced it has expanded the third-party IP offerings for its cost-optimised, low power, mid-range PolarFireFPGAs. With new support of artificial intelligence (AI)/machine learning IP and HDMI 2.0b interfaces, the company’s award-winning PolarFire device can now be used in industrial artificial intelligence applications which leverage the rich resources in the FPGA, particularly the large quantities of digital signal processo...
Power-on-Package system enables higher XPU performance
A new Power-on-Package (‘PoP’) ChiP-set has been announced by Vicor Corporation to include Modular Current Multipliers (‘MCMs’) for high performance GPU, CPU, and ASIC (‘XPU’) processors.PoP MCMs multiply current and divide voltage from a 48V source in close proximity to XPUs to enable higher levels of XPU performance.
High performance GPUs designed for 12V data centres
Vicor has announced a 12-48V non-isolated up converter to support 48V high performance GPUs in data centres that are still relying on legacy 12V power distribution.The 2317 NBM converts 12-48V with over 98% peak efficiency, 750W continuous and 1kW peak power in a 23x17x7.4mm surface-mount SM-ChiP package.The NBM (NBM2317S14B5415T00) provides a complete solution with no external input filter or bulk capacitors required.
Enabling the AI revolution with FPGA-to-ASIC conversion
Faraday Technology has announced its FPGA-to-ASIC conversion service has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, and 3D sensing. It brings remarkable power saving, enhanced performance and lower system cost to meet the specific AI requirement.
50GbE PHY transceiver complies with IEEE 802.3cd and 802.3bs
Storage, networking and connectivity semiconductor solutions provider, Marvell, has announced the launch of the 88X7120, the latest offering in its Alaska C family of high-speed Ethernet physical layer (PHY) transceivers, designed to improve bandwidth and performance in the data centre.
S3 Semiconductors joins Arm Approved design partner programme
Global supplier of mixed-signal and RF Application Specific Integrated Circuit (ASIC) solutions,S3 Semiconductors, has joined the Arm Approved design partner programme. This programme provides customers who wish to adopt Arm embedded solutions a trusted and accelerated path to full custom ASIC design.