Search results for "miniaturisation"

electronica 2024 will bring answers to the major challenges facing the automotive industry, focusing on digitalisation and innovation.

Molex has published a report detailing the significant role of ruggedised, miniaturised interconnect solutions in driving innovation in electronic devices across an expanding array of industries.

MacDermid Alpha Electronics Solutions unveils the MICROFAB SC-40 PLUS. This next-generation, high-purity, high-speed copper plating process is engineered forsemiconductorproduction.

The relentless trend of miniaturisation in electronics continues to challenge engineers to incorporate increasing functionality into progressively smaller devices.

Samsung Electro-Mechanics has introduced the CL32B104KHU6PN#, a high-voltage multi-layer ceramic capacitor (MLCC) tailored for electric vehicle applications such as DC/DC converters.

Melexis recently announced the expansion of its LIN RGB family with the introduction of the MLX81123.

At PCIM 2024, ROHM unveiled its new SiC product offerings as well as outlined its vision for the future. Leading the conversation was Dr. Kazuhide Ino, Managing Executive Officer & Head of Power Device Business at ROHM.

ROHM has developed four models as part of the TRCDRIVE pack series with 2-in-1 SiC moulded modules (two 750V-rated: BSTxxxD08P4A1x4, and two 1,200V-rated: BSTxxxD12P4A1x1) optimised for electric vehicle (xEV) traction inverters.

ROHM has added three new products featuring a rated power of 5W in resistance values of 0.5mΩ, 1.0mΩ, 1.5mΩ to the 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) PMR100 series of standard type metal plate shunt resistors designed for motor control and power circuits in automotive, consumer, and industrial equipment applications.

MacDermid Alpha Electronics Solutions, one of the leaders in integrated technologies and materials for the electronics industry, is set to showcase advanced solutions for die, package, and top-side attach at PCIM Europe.