Search results for "ASIC"

Significantly higher data rates and volumes together with high power densities are resulting in rising requirements for interconnection technologies, too. The new 5G mobile communications generation is undoubtedly an overarching and defining trend here, with applications ranging from infrastructure (base stations) to terminal devices (mobile phones), as well as real-time automation scenarios.

40 years ago a team of engineers at Plessey Semiconductors decided it was time for a change. They headed off into the unknown and founded Swindon Silicon Systems, which stands out now as one of the few UK-based semiconductor companies still operating.

THine Electronics and California Eastern Laboratories (CEL) have announced launching a CDK, Camera Development Kit, which provides an ease-of-design tool to advanced camera system developers.More advanced camera systems require specialised co-dependency of multiple components, resulting in more complicated design challenges.

Recent advances in AI computing have led to a significant increase in the need for high-power processing. Paul Yeaman, Vicor, explains how Power-on-Package (PoP) technology brings power delivery to the substrate for efficiency

Flex Power Modules has announced that its BMR466 and BMR461 digital Point-Of-Load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package. Both modules target deployment in distributed power and intermediate bus voltage architectures within the ICT (Information and Communication Technology), telecom and industrial sectors.

Steve Knoth, Senior Product Marketing Engineer, Power Products at Linear Technology now part of Analog Devices discusses here how high power density systems demand high current converters. The expanding market for high current, low voltage digital ICs reached $9.2bn in 2016. This group of digital ICs includes microcontrollers and microprocessors (µC & µP), programmable logic devices (PLDs), digital signal processors (DSPs), applic...

ON Semiconductor has announced its acquisition of SensL Technologies Ltd. ("SensL"). The acquisition is expected to be immediately accretive to ON Semiconductor's non-GAAP earnings per share. SensL, based in Ireland, is a technology leader specialising in Silicon Photomultipliers (SiPM), Single Photon Avalanche Diode (SPAD) and LiDAR sensing products for automotive, medical, industrial and consumer markets.

Rockley Photonics has announced that it is demonstrating its in-package-optics platform to select customers and development partners. Rockley has developed the world’s first single-chip L3 routing switch to directly integrate 100G network ports using single-modefibre.Leveraging Rockley OpticsDirecttechnology, this platform is among the first of its kind to integrate high-speed optical interconnect with high-scale CMOS digital and mixed-sign...

An alliance formed by Artesyn Embedded Technologies, Bel Power Solutions, Flex and STMicroelectronics defines an industry standard for 48Vin to low voltage, high current DC/DC applications. Demand for such conversion is expected to increase as internet data traffic increases with the advent of increased automation in the home and at work, as well as the data traffic required for autonomous vehicles, says Flex.

ICsense, a TDK group company, is a supplier of analogue, mixed-signal and high-voltage ASICs (Application Specific ICs). The company has filed another patent to strengthen its portfolio in analogue circuits. The invention allows users to implement analogue, floating high-voltage switches that don’t load its connected lines. Contrary to existing solutions using large resistances and thereby large time constants, this invention provides a sol...