Search results for "TSMC"

Before GlobalFoundries entered the IC foundry market, TSMC was by far the technology leader among the major pure-play IC foundries. In 2012, about 37% of TSMC’s revenue is expected to come from ≤45nm processing. As expected, with GlobalFoundries’ fabs producing AMD’s MPUs over the past few years, its processing technology is skewed toward leading-edge feature sizes.

Cadence Design Systems today announced that the first products in the Cadence DDR4 SDRAM PHY and memory controller design intellectual property family have been proven in silicon on TSMC’s 28HPM and 28HP process technologies.

Despite reducing its 2012 planned capital spending by $1.0 billion on September 7, 2012, Intel and four other large semiconductor suppliers are still expected to account for almost two-thirds of industry-wide capital expenditures in 2012, according to new data released by IC Insights.

Spending on research and development by semiconductor companies worldwide is expected to grow 10% in 2012 to a record-high $53.4 billion compared to the current peak of $48.7 billion set in 2011, according to the Mid-Year Update of IC Insights’ 2012 McClean Report. The increase will lift R&D spending by chip companies to 16.2% of total semiconductor sales in 2012, which are now forecast to rise 3% to $329.8 billion from revenues of $321.4 bill...

Picochip has launched its next generation of public access and enterprise silicon. The new devices are the PC3024 for enterprise use and the PC3032 for metro and rural small cells. These are the latest members of Picochip’s market leading family of small cell System-on-Chip (SoC) products, and build on the success of the PC323 and PC33 - the latter being the first SoC on the market for the new breed of ‘small cell’ and ‘metro cell’ bas...

Accent S.p.A, has announced that it has entered into a technology licensing agreement with ARM for the ARM7TMI-S, the ARM926EJ-S and the ARM1136J-S synthesisable processors, as well as a range of PrimeCell peripherals and Physical IP technology. The agreement will see Accent focus on the use of ARM processors for all new design projects realised for fabless and chipless IC customers requiring a core licence through Accent.

Dialog Semiconductor plc today announced that the company is working closely with foundry partner Taiwan Semiconductor Manufacturing Company on a bipolar-CMOS-DMOS (BCD) technology specifically tailored to high-performance power management ICs for portable devices.

A ranking of the 1H12 top semiconductor suppliers will be included as part of IC Insights' upcoming August Update to The McClean Report. As shown in Figure 1, there are three pure-play foundries in the top 20 ranking. In total, these foundries logged a 20% increase in 2Q12/1Q12 sales.

Yole Développement's FOWLP Patent Analysis is now available. Fan-Out Wafer Level Packaging is the most innovative advanced packaging technology today, adopted for mobile phone and consumer electronics applications. After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis of the technical contents of patents.

EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro™ has been included in TSMC’s Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design. Analog, mixed-signal, and RF design teams at leading semiconductor companies worldwide now can use Jivaro to efficiently reduce post layout netlist parasitics to speed up their overall simulation time for their 28nm AMS proj...