Search results for "Panasonic"

At the recent IEEE IITC conference in Grenoble, France, nanoelectronics research center imec and Tokyo Electron Limited jointly presented a direct copper etch scheme for patterning Cu interconnects. The scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.

During the IEEE IITC conference in Grenoble, nanoelectronics research centre imec and Lam Research jointly presented a bottom-up prefill technique for vias and contacts. The technique, based on ElectroLess Deposition (ELD) of cobalt, is a highly selective method resulting in void-free filling of via and contact holes. Potentially increasing the circuit performance, it is a promising path to scaling advanced interconnects and enabling future logic...

At PCIM Europe 2015, it’s all about power electronics and its applications. Besides around 420 exhibiting companies, visitors can additionally look forward to a varied programme at the two free of charge visitor forums in the exhibition halls.

Qualcomm has announced that its subsidiaries, Qualcomm Technologies (QTI), Qualcomm Atheros, Qualcomm Life and Qualcomm Connected Experiences (QCE), are achieving significant adoption of their broad connectivity, computing and solutions for the IoE. Driven by the significant growth and diversity of interconnected devices, Qualcomm companies are delivering the solutions and collaborating with technology leaders to empower manufacturers to create t...

Besides the power efficiency, a key performance requirement for point of load power supply ICs is the transient performance. Sudden changes in the current drawn by the load (for example, an FPGA) require a fast response from the power supply. Such fast variations of the output current, however, cause transient spikes on the output voltage, whose amplitude and duration depend on the transfer function of the regulation loop.

Infineon Technologies and Panasonic have announced an agreement under which both companies will jointly develop Gallium nitride (GaN) devices based on Panasonic’s normally-off (enhancement mode) GaN on silicon transistor structure integrated into Infineon’s SMD packages. In this context Panasonic has provided Infineon with a license of its normally-off GaN transistor structure.

Panasonic has introduced the ZC series of conductive polymer hybrid aluminium electrolytic capacitors with 45% higher ripple current. Suiting high-reliability and other applications which require low leakage, high capacitance and high stability, the 125°C hybrid capacitors feature a high-withstand voltage of 25-63V and low leakage current of 0.01 CV or 3µF.

Socionext Embedded Software Austria (SESA), a subsidiary of Socionext, has announced the start of operations. Following the consolidation of the system LSI businesses of Fujitsu and Panasonic, Fujitsu Embedded Solutions Austria was transferred with all its employees and assets, including its software platform CGI Studio, to Socionext.

Forecasters say the Internet of Things (IoT) market will be worth between $7trn and $9trn by 2020. That is exciting chip makers and their distributors. Rutronik is keen to promote its activities on behalf of its suppliers and is rolling out a series of one-day seminars which will embrace networking with sensor developments, two technologies driving many developments related to the Internet of Things (IoT).

Socionext has started sampling the world’s first HEVC/H.265 - compatible encoder IC, the MB86M31, along with an evaluation board, the MB86M31-EVB, and SDK for drivers and applications. The device is capable of real-time encoding of 4K/p60 video with the latest video compression technology. HEVC achieves the transmission of realistic 4K video at half the cost of the preceding H.264 technology without a loss of quality.