Search results for "Panasonic"
imec & SPTS Technologies develop processes for 3D IC wafer stacking
At SEMICON West, imec and SPTS Technologies announced that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.
Aluminium capacitor features low ESR
A low ESRconductive polymer aluminium capacitor with high temperature, ensuring the devices are suitable for demanding applications, have been introduced by Panasonic Automotive & Industrial Systems. Part of the SP Caps range, the HX series devices have an ESR down to 4.5mΩ and an operating temperature range from -55 to +125°C means that devices have a life of 10 years at +85°C, according to the company.
GaN - promise to reality
The next generation of power electronics is taking shape, argues Markus Behet, EpiGaN. The wide-bandgap compound semiconductor material is suited for switching devices that operate at high frequencies without suffering major losses.
Reduced form factor features in Bluetooth Low Energy module
The Panasonic PAN1740 next-gen BLE Module, designed to enable low-energy wireless connectivity, is on sale at Farnell element14. With demand for this type of connectivity accelerating in recent times, the BLE offers a reduced form factor, significantly lower power consumption and embedded Software Stack.
Surface mount GaN transistor reduces power consumption
Claimed to be the industry’s smallest enhancement mode 600V GaN transistor, is offered in the X-GaN package by Panasonic.
Adding Bluetooth connectivity to your IoT design
We have the current trend of the IoT to thank for driving a surge of embedded system development. As more and more B2B and B2C organisations strive to cloud-enable their products and develop a new range of services offering connectivity either direct to the cloud or via a gateway is a vital element of any design. By Simon Duggleby, Marketing Manager, Semiconductors, RS Components.
Asia-Pacific LED market to reach $35.79bn by 2020
According to a new report by ApacMarket.com, entitled Asia-Pacific Light Emitting Diodes Market - Analysis, Segmentation and Forecast, 2014 - 2020, the Asia-Pacific LED market is expected to reach $35.79bn by 2020, at a CAGR of 15.7% during the forecast period. The high brightness LED segment is expected to grow swiftly and continue to account for the highest market share, contributing to over 60% of the total market revenue, throughout the forec...
The MEMS industry gets its 2nd wind
According to Yole Développement's latest MEMS report 'Status of the MEMS Industry', the MEMS industry is preparing to exceed $20bn by 2020 (in 2014 it represented an $11.1bn business for Si-based devices).
NEPCON China post-show success
NEPCON China 2015, organised by Reed Exhibitions and CCPIT, took place at the Shanghai Expo Center from 21st to 23rd April 2015. The three-day event was a success, bringing together nearly 22,000 trade visitors and high quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide.
TI dominates analogue devices market with shrewd purchases, says report
Texas Instruments was again the leading supplier of analogue devices in 2014 with $8.1bn in sales, and increased its analogue marketshare to 18%, according to rankings of top suppliers of major IC product categories found in IC Insights’April UpdatetoThe McClean Report 2015. The top 10 analogue IC suppliers accounted for 57% of total analogue sales in 2014, up slightly from 56% in 2013.