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The recent series of polymer capacitors, from Panasonic Automotive & Industrial Systems, withstand high temperature range and feature a low ESR. The POSCAP TC series has a high resistance to stress, making it suited for industrial and other applications that require a life of 10 years.

At SEMICON West, imec and SPTS Technologies announced that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.

A low ESRconductive polymer aluminium capacitor with high temperature, ensuring the devices are suitable for demanding applications, have been introduced by Panasonic Automotive & Industrial Systems. Part of the SP Caps range, the HX series devices have an ESR down to 4.5mΩ and an operating temperature range from -55 to +125°C means that devices have a life of 10 years at +85°C, according to the company.

The next generation of power electronics is taking shape, argues Markus Behet, EpiGaN. The wide-bandgap compound semiconductor material is suited for switching devices that operate at high frequencies without suffering major losses.

The Panasonic PAN1740 next-gen BLE Module, designed to enable low-energy wireless connectivity, is on sale at Farnell element14. With demand for this type of connectivity accelerating in recent times, the BLE offers a reduced form factor, significantly lower power consumption and embedded Software Stack.

Claimed to be the industry’s smallest enhancement mode 600V GaN transistor, is offered in the X-GaN package by Panasonic.

We have the current trend of the IoT to thank for driving a surge of embedded system development. As more and more B2B and B2C organisations strive to cloud-enable their products and develop a new range of services offering connectivity either direct to the cloud or via a gateway is a vital element of any design. By Simon Duggleby, Marketing Manager, Semiconductors, RS Components.

According to a new report by ApacMarket.com, entitled Asia-Pacific Light Emitting Diodes Market - Analysis, Segmentation and Forecast, 2014 - 2020, the Asia-Pacific LED market is expected to reach $35.79bn by 2020, at a CAGR of 15.7% during the forecast period. The high brightness LED segment is expected to grow swiftly and continue to account for the highest market share, contributing to over 60% of the total market revenue, throughout the forec...

According to Yole Développement's latest MEMS report 'Status of the MEMS Industry', the MEMS industry is preparing to exceed $20bn by 2020 (in 2014 it represented an $11.1bn business for Si-based devices).

NEPCON China 2015, organised by Reed Exhibitions and CCPIT, took place at the Shanghai Expo Center from 21st to 23rd April 2015. The three-day event was a success, bringing together nearly 22,000 trade visitors and high quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide.