Search results for "panasonic"
TTI delivers SD/microSD cards & connectors from Panasonic & Molex
TTI offers the great combination of Panasonic’s SD and microSD memory cards with matching connectors from Molex. Built for ruggedised industrial and commercial OEM applications, Panasonic’s SD cards can operate in severe environmental conditions (temperature, electrostatic, impact and magnetic) and offer power failure robustness and program/erase endurance.
Background suppression improves human proximity detection
A series of human detection proximity sensors have been unveiled by Panasonic Automotive & Industrial Systems which are 35% thinner (12.7 compared with 19.5mm) than previous versions and are also plug-and-play to ease installation. The MA Motion seriesfeature built-in trigonometric background suppression, so they are unaffected by changing scenes or by people passing by outside the detection range.
NEPCON South China 2015 embraces smart manufacturing
'Internet+' is definitely the defining phrase of 2015. Thanks to a national internet+ strategy, the electronics industry is transitioning from a 'made in China' ethos, to Chinese-led smart manufacturing, featuring advanced smart automation technologies. Those able to combine cross-disciplinary know-how will win big in the upcoming smart age. NEPCON South China 2015, planned for the Shenzhen Conference and Exhibition Center from 25th to 27th Augus...
Polymer capacitors withstand high temperature range
The recent series of polymer capacitors, from Panasonic Automotive & Industrial Systems, withstand high temperature range and feature a low ESR. The POSCAP TC series has a high resistance to stress, making it suited for industrial and other applications that require a life of 10 years.
imec & SPTS Technologies develop processes for 3D IC wafer stacking
At SEMICON West, imec and SPTS Technologies announced that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.
Aluminium capacitor features low ESR
A low ESRconductive polymer aluminium capacitor with high temperature, ensuring the devices are suitable for demanding applications, have been introduced by Panasonic Automotive & Industrial Systems. Part of the SP Caps range, the HX series devices have an ESR down to 4.5mΩ and an operating temperature range from -55 to +125°C means that devices have a life of 10 years at +85°C, according to the company.
GaN - promise to reality
The next generation of power electronics is taking shape, argues Markus Behet, EpiGaN. The wide-bandgap compound semiconductor material is suited for switching devices that operate at high frequencies without suffering major losses.
Reduced form factor features in Bluetooth Low Energy module
The Panasonic PAN1740 next-gen BLE Module, designed to enable low-energy wireless connectivity, is on sale at Farnell element14. With demand for this type of connectivity accelerating in recent times, the BLE offers a reduced form factor, significantly lower power consumption and embedded Software Stack.
Surface mount GaN transistor reduces power consumption
Claimed to be the industry’s smallest enhancement mode 600V GaN transistor, is offered in the X-GaN package by Panasonic.
Adding Bluetooth connectivity to your IoT design
We have the current trend of the IoT to thank for driving a surge of embedded system development. As more and more B2B and B2C organisations strive to cloud-enable their products and develop a new range of services offering connectivity either direct to the cloud or via a gateway is a vital element of any design. By Simon Duggleby, Marketing Manager, Semiconductors, RS Components.