Search results for "Fraunhofer"

271 experts from 21 countries met on the 11th and 12th March 2015 in Copenhagen / Denmark to inform themselves in six keynotes, a panel discussion and 55 lectures on the latest applications and trends on the topic Smart systems integration and to visit the accompanying exhibition. The conference was conducted in 2013 with the MEMS Industry Group. This underlines the importance of the smart systems integration conference and exhibition for this in...

The MOST Cooperation has announced the conference programme for the upcoming seventh MOST Forum on April 21, 2015 in Germany. Conference presentations will examine higher speed rates as well as different physical layers and transceivers. In the area of compliance and quality assurance, presenters will look at virtual prototyping, testing and simulation.

The power electronics supply chain is evolving. Yole Développement (Yole) analysts confirm this trend in its latest technology and market report, titled Status of the Power Electronics Industry. Chinese companies’ vertical integration is challenging diverse historical market leaders, while Europe & US companies are pushing horizontal integration. What is the shortest road to the success?

Expanding their existing cooperation, RoodMicrotec and Fraunhofer Institute for Integrated Circuits IIS aim to offer their customers complete solutions throughout the whole supply chain, from ASIC design to volume production. Fraunhofer IIS will provide their customers with a more efficient and complete supply chain solution from concept through all processes of design, manufacture, assembly, electrical test, qualification and finally delivery of...

Jakajimahas organised the second editions of both the 3D Printing Materials and 3D Bioprinting Conferences in Maastricht, the Netherlands.On 27th(Materials) and 28th (Bioprinting) January, an international, audience consisting of industry professionals, industry stakeholders, end-users, governmental bodies and universities will attend the full day seminar.

The Consumer Electronics Association has revealed that executives from Bosch, Cisco and Comcast will participate in the 'Fast Innovation: Disrupt or be Disrupted' keynote panel at the 2015 International CES, 6th to 9th January in Las Vegas.

Thousands of electronic elements printed onto film or paper in a few hours will be one of the features at the LOPEC 2015 exhibition and conference in Munich (March 3-5, 2015). A Demo Line at the event will show how it's done. During the fair, a complete production line will produce examples of printed electronics "to go".

Fraunhofer has successfully validated a wind lidar buoy, confirming the commercial acceptance of wind data from the on-board ZephIR lidar for use in floating offshore energy assessments, according to the Carbon Trust Offshore Wind Accelerator roadmap's criteria for the commercial acceptance of floating lidar technology.

The Multi-Project Wafer (MPW) or shuttle runIC prototyping service from theFull Service Foundry division of ams is now available with anupdated schedule for 2015. Combiningseveral designs from different customers onto a single wafer, the serviceoffers significant cost advantages for foundry customers as the costs for wafers and masks are shared among a number of different shuttle participants.

Engineered Material Systems is a sponsor for the Back Contact Workshop in Amsterdam (Nov 13/14). The workshop is an annual event hosted by The Energy Center of The Netherlands (ECN) and The Fraunhofer (ISE) Institute.