Search results for "Fraunhofer"
Fraunhofer IIS brings satellites into the 5G era
Global mobile communications that reliably reach every remote region, leaving no gaps on the map? Satellites play a key role in achieving this goal.
Fraunhofer researchers developed OLED stacks
Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed novel OLED stacks that enable significantly bright microdisplays.
Fraunhofer IPMS bids farewell to Hubert Lakner on his retirement
Prof. Dr.-Ing. Dipl.-Phys. Hubert Lakner worked for 21 years as Institute Director at theFraunhofer InstituteforPhotonic Microsystems, headquartered in Dresden.At the same time, he held the Chair of ‘Optoelectronic Devices and Systems’ at the Institute for Semiconductor and Microsystems Technology at the University of Dresden.
Fraunhofer IPMS remains research partner for GlobalFoundries
Fraunhofer IPMS has expanded its long-standing collaboration with GlobalFoundries and has launched several research projects on innovative integrated memory concepts.
New cryostatic systems elevate current research on qubits
The Centre Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.
AI chip SENNA accelerates spiking neural networks
The Fraunhofer Institute for Integrated Circuits IIS hasdeveloped an AI chipfor processing spiking neural networks (SNNs).
Fraunhofer’s new options for integrating RFicient receivers
Fraunhofer is now offering an even simpler way to use RFicient, its ultra-low-power wireless receiver.
Using robots to disassemble electronic waste
Millions of tonnes ofelectronic wasteare produced worldwide every year. Only a fraction of this is recycled or refurbished.
nanoSPECTRAL chip: a miniature cost-effective spectrometer
The nanoSPECTRAL chip is a chip-size spectrometer based on the nanoSPECTRAL technology developed at the Fraunhofer Institute for Integrated Circuits IIS.
10 years of improved materials for microchip interconnections
More power, more energy-efficiency, more complexity – manufacturers of modern microchips are constantly facing new challenges, especially regarding the electrical connections required.