Search results for "Fraunhofer"
Simulation & analysis environment enables optical components
VPIphotonics has announced the release of the VPIphotonics Transmission & Component Design Suite Version 9.5, which includes the following simulation and analysis tools:• VPItransmissionMaker Optical Systems• VPIlabExpert• VPIcomponentMaker Fiber Optics• VPIcomponentMaker Photonic Circuits• VPIplayer
LASER World of PHOTONICS 2015 programme announced
From 22nd to 25th June, Munich will be the meeting place for the international photonics industry with more than 1,180 exhibitors and 27,000 visitors expected at LASER World of PHOTONICS 2015. With its eight conferences and approximately 2,700 lectures, the World of Photonics Congress, held in the ICM Internationales Congress Center München, 21st to 25th June, is one of the most important scientific platforms in the world.
Earth's magnetosphere measured accurately from space
The foundry division of ams AG, Fraunhofer Institute for Integrated Circuits IIS and the Space Research Institute (IWF) of the Austrian Academy of Sciences (OeAW) have jointly presented the very promising results of highly accurate measurements of the Earth’s magnetosphere from space, as part of NASA’s ‘Magnetospheric Multiscale’ mission launched in March 2015.
productronica to present its first independent innovation award
The productronica innovation award is the first independent award in the electronics production industry and will be bestowed by productronica. To have a chance to win the first productronica innovation award, entries must satisfy very clear criteria. They must be technologically innovative, feature a totally new design or be easy to integrate into systems.
Mixed signal methodology offers high automation
The Intelligent IP Mixed Signal Design Flow methodology developed by the Design Automation group at the Fraunhofer Institute for ICs IIS offers an unparalleled degree of automation, especially for the otherwise time-consuming, error-prone analogue portion of the design.Mixed-signal ICs are found in many of today's microelectronics, from safety-critical automotive applications to medical and aerospace systems.
Hand soldering competition at SMT Hybrid Packaging 2015
For the first time, SMT Hybrid Packaging will host a hand soldering competition in hall 7, stand 500. The main prize is a place in the Hand Soldering Competition 2016, which takes place in Las Vegas. The prize will include flights and accommodation, as well as a cash award of €300.00.
Take a virtual factory tour with sara LBS
sara LBS offers the market a complete package solution which can help to make a factory or warehouse run more efficiently. However, without a display area the size of a small warehouse, it can be hard for the company to properly demonstrate the true depth of its product range. To remedy this it has built a virtual factory which shows some of its most popular products in action in a realistic working environment.
Infineon demonstrates how it supports secure Industry 4.0
Microelectronics is the key enabling technology for Industry 4.0, the networked production of the future. At the Hannover Messe, Infineon Technologies demonstrates how it supports a secure Industry 4.0.
Production concept could give rise to new types of LEDs
A fully optimised production concept for LED components and light modules in which all the process steps are co-ordinated with one another could give rise to completely new types of LEDs and reduce their manufacturing costs.
Partners take wraps off 5G channel sounding solution
Rohde & Schwarz and Fraunhofer Heinrich Hertz Institute (HHI) will present a novel 5G channel sounding solution at the NGMN Industry Conference in Frankfurt/Main. The solution comprises the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyser in combination with a synchronisation unit and application software from Fraunhofer HHI.