Search results for "Fraunhofer"

The abstract submission deadline for the Call for Tutorials of SMT Hybrid Packaging 2016 has been extended until the 19th October 2015. SMT Hybrid Packaging takes place from 26th to 28th April 2016 in Nuremberg.

Due to the ongoing demand, the period to submit abstracts for the Call for Papers of Smart Systems Integration 2016 has been extended. Speakers may submit abstracts and help to shape the conference programme until 20th October 2015. Call for Papers submission requirements and further information are available on the website.

productronica 2015 (10th to 13th November) will open with a CEO Roundtable discussion on Cyber Security. Participants are leading personalities from the industrial, commercial and political sectors and the discussion will be held in English. This will be a moderated panel discussion and will provide a unique insight into the minds of upper management in the electronics manufacturing industry.

Now established as a leading event on the global space calendar, the continued success of Space Tech Expo, which enjoyed a further 45% rise in attendance along with a 25% increase in exhibitor numbers earlier this year, has prompted the Californian-based event to now expand into Bremen, one of Europe’s leading aerospace hubs. More than 180 exhibitors are already signed up, among them industry, research and testing majors such as OHB, DLR, T...

In the coming year a new event called Experience Composites - powered by the JEC Group will be staged in Augsburg from 21stto 23rdSeptember 2016 in a Multi-Location-Format. It is being set up by Messe Augsburg in collaboration with the JEC Group and Carbon Composites. The internationally organised event will be designed to be a showcase for the entire industry, focussing on machinery and plant construction, aviation and space travel, construction...

Microsemi has announced the LX2410A IDEAL solar bypass device, designed to provide a bypass path in PV module applications. Featuringthe company's patented CoolRUN technology, the LX2410A reduces the cost and increases the reliability of photovoltaic solar modules by replacing the Schottky diodes in junction boxes with an under the glass, higher performance solution.

Students from the University of Science and Technology of Beijing have won the Grand Final of the Freescale Cup Challenge 2015, hosted by the Fraunhofer Institute for Integrated Circuits IIS in Erlangen. They prevailed and won the race after a fierce competition that brought together the winners from regional rounds around the globe. The teams were from universities in India, Switzerland, Mexico, Brazil, the USA, Malaysia, Taiwan, South Korea and...

They are barely visible to the naked eye and have names like 03015 or 01005, but they are achieving great new things in the world of electronics. The smallest of components, such as microchips, capacitors and resistors, are gaining ground when it comes to the manufacturing of electronic products. They offer new technological solutions and challenge the industry to make compromises, so as to keep up-to-date with the trend towards miniaturisation.

COSEDA Technologies GmbH in Dresden began its business activities in July 2015. The team, consisting of former employees of the Fraunhofer research institute IIS/EAS, offers software that companies can use to develop complex electronic products more reliably, quickly and cost-effectively. The company can rely on the know-how accumulated during more than 15 years of co-operation by Fraunhofer IIS/EAS with the semiconductor industry.

SMT Hybrid Packaging's Call for Tutorials invites experts from industry and academia to submit abstracts relating to system integration in microelectronics. Deadline for any submissions is 5th October 2015.