Search results for "Fraunhofer"

This year’s LOPEC (the International Exhibition and Conference for the Printed Electronics Industry) which concluded today – April 7 - featured a record 148 companies from 18 countries as well as more than 2000 visitors from 40 countries. Falk Senger, Managing Director of organiser Messe München commented, "This year, we have seen our exhibitor numbers increase by over 10 percent. More and more sectors are putting their trust in ...

According to statistics, the majority of accidents occur at dusk or at night – poor visibility is often the trigger. Intelligent headlights adapt to the current traffic situation, and can be a remedy. In collaboration with industry partners, Fraunhofer researchers have developed a high-resolution illumination system with more than 1,000 LED pixels: It offers considerably more options for precise light distribution than previous solutions ha...

At the Embedded World 2016 Fraunhofer HHI's video experts present two specific hardware implementations. Visit us at the joint Fraunhofer booth 460, hall 4. You find the following highlights at our joint booth 460 in Hall 4:

LOPEC 2016 (April 5 to 7 in Munich) will feature an extensive supporting program as well as the LOPEC Demo Line, which will give visitors the chance to watch a live demonstration of electroluminescent illuminated text being printed onto packaging. Also among the highlights are guided tours based around this year's key themes: the automotive sector, consumer electronics, and wearable technology.

Rehm Thermal Systems looks forward to meeting you at this year’s SMT/Hybrid/Packaging in Nuremberg from April 26th to 28th, Europe's leading trade fair for system integration in microelectronics. The electronics industry continuously meets new challenges in the processing of sensitive electronic components – from processing the smallest components, the highest standards in void-free solder joints and increased quality through resistan...

The anniversary event of Smart Systems Integration offers in its conference a wide range of topics and casts an intensive glance at current trends and future developments in the industry. Latest digital solutions regarding the interconnection of sensors, equipment or products and their data analysis play an important role.

The embedded AWARDS 2016 were presented at a festive ceremony held during an international press tour on the first day of the embedded world 2016 on 23rd February 2016. The coveted award is a prize that the embedded community awards to its most active and innovative members.

The embedded AWARD has already become established as a great tradition. For the 12th time in succession, the embedded AWARDS will recognise especially innovative products and developments in the categories hardware, software and tools. The coveted industry awards will be presented during the international press tour on the first day of the fair on 23rd February 2016, when an independent, high-calibre jury will announce the winners.

Heliatek R&D teams reached a record conversion efficiency of 13.2% for an OPV multi-junction cell, setting a new world record for the direct conversion of sunlight into electricity using organic photovoltaic cells. The measurement was independently confirmed by Fraunhofer CSP.

Top speakers from industry and science present their latest research results and developments during the two-day conference of Smart Systems Integration in Munich / Germany from 9th – 10th March 2016.