Search results for "Yole"

Combo sensors continue their growth in a market expected to reach $1.4bn in 2019, overcoming discrete sensors. Yole Développement proposes a deep analysis of the inertial combos for consumer application, with its report, '6&9 Axis Sensors Consumer Inertial Combos'. According to Yole’s analysis, cellphones and tablets still drive the market but wearables will soon take their place in the landscape.

Yole Développement has identified a growing interest for thin film PZT in the semiconductor industry, due to its very promising piezoelectric properties. For example, Epson has released its second generation inkjet head based on thin film PZT for small office applications, proving the maturity of the technology.

The EV/HEV supply chain is evolving and power electronic module manufacturing attracts more and more companies, car makers, modules suppliers, chip makers... to develop their own expertise, announces Yole Développement, in its latest report 'Power Electronics in Electric and Hybrid Vehicles'. Industrials develop innovative technologies at the substrate, integration and packaging levels, to enhance power module performance and push the EV/H...

Although MEMS timing products and their relative advantages have long been talked about, the market acceptance of these products is still relatively low. Sally Ward-Foxton investigates why.

The 2014 Advanced Packaging & Integration Technology Symposium, organised by NCAP China (National Center for Advanced Packaging) and Yole Développement, was successfully held. Yole is particularly interested in the advanced packaging industry in Greater China and would like to ensure business positioning and increase it's existing network in this geographic area.

A report has been released by Yole Développement which discusses the direct impact of investments, mergers and acquisitions on the solid-state medical image sensor market. The report, titled 'Solid State Medical Imaging: X-ray and Endoscopy', revealed that the medical imaging market is evolving slowly, with 2.1 million units in 2013.

The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain, says Yole Developpement in an update to its technology and market analysis, LED Packaging Technology & Market Trends.

Using the recently qualified, proprietary THELMA60 (60µm Thick Epi-poly Layer for Micro-gyroscopes and Accelerometers) surface-micromachining fabrication process, STMicroelectronics has started the production of MEMS sensors.

Silicon Carbide (SiC) propagates over all industrial segments, announces Yole Développement. Power factor corrector (PFC), photovoltaic inverter, motor control … and more represented a $100 million business in 2013.

“The last months have been very active in term of mergers and acquisitions in the CMOS image sensor (CIS) business”, comments Yole Développement (Yole)...