Search results for "Yole"

CS International hit a new high by assembling its strongest ever line-up of speakers. At the meeting, more than 300 delegates gained great insight into the potential of various aspects of the compound semiconductor industry, thanks to presentations from seven leading market analysts.

The first International Forum on Sapphire Market & Technologies has been announced.Organised by Yole and CIOE, the one-day event is scheduled to take place on 3rd September 2015, in Shenzhen, alongside the 17th China International Optoelectronic Expo 2015.

According to Yole Développement, Wide Band Gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is how? Industry players have identified many module packaging challenges. Yole has analysed their insights, and is now presenting an overview of the issues.

According to a report published by Yole Développement (Yole), the CMOS Image Sensor (CIS) market is expected to grow at a CAGR of 10.6%, reaching $16.2bn by 2020. In the report, titled ‘Status of the CMOS Image Sensor Industry, 2015 Edition’, the company discuss the way in which the automotive, medical and surveillance sectors are driving the market and technology efforts of existing and new players.

According to Yole Développement, the technological choice between STTMRAM/MRAM and RRAM will be made in the next two years. In its report, titled 'Emerging Non Volatile Memory (NVM) Technology & Market Trends', the company describes why and how emerging NVM technologies will be increasingly used in industrial and transportation, enterprise storage, wearables, mobiles devices, mass storage and MCU smart cards.

Initially focused on the military market, uncooled thermal camera sales have grown significantly due to cost reduction of micro bolometers and growing adoption in commercial markets. The market research and strategy consulting company, Yole Développement confirmed this growth last July, announcing +25% CAGR between 2014 and 2019 in its infrared imaging report, ‘Uncooled Infrared Imaging Technology & Market’.

According to Yole Développement, 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications. Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube have all brought devices to the market that integrate 3D TSV technology.

Enabling a new class of always-on applications using FPGAs. By Subra Chandramouli, Director, Consumer Segment Marketing, Lattice Semiconductor.

According to Yole Développement, both the compute (DDR3/DDR4) and mobile varieties (LPDDR3/LPDDR4) of DDR memory will reach the end of their respective journeys soon,as the DDR interface reportedly cannot run at data rates higher than 3.2Gb/s in a traditional computermain memory environment. Several DRAM memory architectures based on 3D layer stacking and Through-Silicon-Via (TSV) have evolved to carry memory technology forward.

In its latest report, ‘Technologies & Sensors for the Internet of Things’, Yole Développement states that “The most important added value IoT solutions will come from the process of generating data”. IoT, according to Yole’s analysts, comprises hardware, cloud and data processing, gathering multiple applications from sectors including industrial sensors, wearable electronics and home automation.