Search results for "Yole"

The LED packaging industry is moving toward further cost reduction and new technologies including Flip Chip and Chip Scale Package (CSP), says Yole Développement in its latest report on packaging for LED: LED Packaging Technology and Market Trends 2014. These market and technology trends directly impact the LED & advanced packaging industry and its supply chain, especially at the material and equipment levels: whereas the equipment mar...

Apple has announced that its 4.7 and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover. Sapphire remains in the camera lens cover and the touch ID sensor, features that were already present on the iPhone5s. Yole Développement believes that technical and manufacturing issues in the supply chain have prevented Apple from using sapphire as the display cover in this year's iPhon...

Targeting high-end mobile handsets and smartphones with 1080p resolution, Toshiba Electronics Europe introduces a 1.12μm CMOS image sensor with an optical height of 1/2.4". The T4KA7 sensor enables engineers to develop camera modules with a z-height of 6mm or less for ultrathin and ultralight mobile devices.

Asymposiumaimed at leaders of the advancedpackaging industry has been organised byYole Développement (Yole)and the National Center for Advanced Packaging (NCAP China). The event, entitledAdvanced Packaging & Integration Technology Symposium, will focus on3D integration technologies and market trends, interposers activities, roadmaps and key players,MEMS packaging and manufacturing readiness.

Yole Développement has published a report describing and analysingMEMS technologies and market trends. The report, entitled 'Status of the MEMS Industry',announces 2013-2019 market data covering more than 220 MEMS applications, with an in-depth study of the industrial and strategic evolutions.

A recent market study, titled Uncooled Infrared Imaging Technology & Market and compiled by Yole Développement, has confirmed the uncooled thermal camera market downturn in 2013, with -5% CAGR. Overall growth is now driven by low-end applications, requiringmuch higher cost reduction at both material and manufacturing levels.

GaN devices for power electronics are on the verge of big growth, but what are the driving forces behind this growth? Sally Ward-Foxton investigates for ES Design magazine.

Existing commercial application and new consumer applications will drive infra-red imaging market growth, according to a new report published byYole Développement.Under this report, entitled Uncooled Infrared Imaging Technology & Market Trends, 2014 edition, experts analyse the latest industry news, identify new market entrants and give a clear understanding of the impact on the market structure.

Yole Développement has released a new report '3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update' which provides an overview of the TSV implementation for various devices and packages including memories, logic, MEMS, photonics, CIS and other applications.

With material-based science technologies becoming more mainstream, Invest in Photonics organisers are encouraging people to invest in photonics. Organisers claim that this technology, which uses light to run devices and transmit data, is in the process of revolutionising healthcare, transforming computing and manufacturing and addressing challenges in energy-efficiency with intelligent light management systems.