Search results for "TSMC"

DesignWare Foundation IP, including Logic Libraries and Embedded Memories, that meets stringent automotive AEC-Q100 Grade 1 temperature requirements on the TSMC 16nm FinFET Compact (16FFC) and 28nm High-Performance Compact+ (28HPC+) processes have been announced by Synopsys.

Further enhancements and optimisations for various products within the Calibre Platform was announced by Mentor Graphics Corp, and AFS (Analogue FastSPICE) Platform, as well as the completion of further certifications and reference flows for TSMC (Taiwan Semiconductor Manufacturing Corporation) 16FFC FinFET and 7nm FinFET processes.

In addition to the monthly Updates, IC Insights’ subscription to The McClean Report includes three “subscriber only” webcasts. The first of these webcasts was presented on 3rd August, 2016, and discussed semiconductor industry capital spending trends, the worldwide economic outlook, the semiconductor industry forecast through 2020, as well as China’s failures and successes on its path to increasing its presence in the IC i...

IC Insights released its August Update to the 2016 McClean Report earlier this month. This Update included an update of the semiconductor industry capital spending forecast, a look at the top-25 semiconductor suppliers for 1H16, including a forecast for the full year ranking and part 1 of an extensive analysis of the IC foundry industry (the ranking of the top-10 pure-play foundries is covered in this research bulletin).

A provider of highly integrated power management, AC/DC power conversion, Solid State Lighting (SSL) and Bluetooth low energy technology, Dialog Semiconductor, have announced it is demonstrating its first Gallium Nitride (GaN) power IC product offering, using Taiwan Semiconductor Manufacturing Corporation’s (TSMCs) 650V GaN-on-Silicon process technology.

Yole Développement (Yole) is analysing the current market and technologies trends in the fan-out market and has published the results within a new report: Fan-Out: Technologies & Market Trends 2016.

For integrated circuits with really high volumes, such as MCUs, SESAME uHD (ultra High Density), the flagship product in Dolphin Integration's standard cell library offering, is paramount to decrease die costs. It stars its patented pulsed latches as Spinner Cells instead of standard D-flip flops, openly documented in 'Thorough validation: the conundrum of Pulsed latch libraries turned practical as Spinner systems', which come-up best for low-pow...

An interconnect resistivity model to support the screening and selection of alternative interconnect metals and liner-barrier materials at the 7nm node and beyond has been announced byimec and Synopsys.

sureCore Ltd., the low power SRAM IP leader, has announced the immediate availability of its TSMC 40nmULP process technology memory compiler. The new compiler facilitates utilisation of sureCore's recently announced 40nm Ultra Low Voltage SRAM IP that effectively operates at a record-setting 0.6V across process voltage and temperature.

sureCore has revealed that its latest Ultra-Low Voltage SRAM IP effectively operates at a record-setting 0.6V across process, voltage and temperature. The results are silicon-proven on TSMC's 40nm Ultra Low Power CMOS process technology.