Search results for "miniaturisation"

A typical question put to a manufacturer of reflow soldering systems like Rehm Thermal Systems is often: ‘What is the benefit of a nitrogen atmosphere?’ In the following Rehm has explored this question in relation to typical soldering defect scenarios, including those involving solder balls, beading, voiding, whiskers, graping, head-in-pillow, wetting defects and tombstones.

In the various production steps, highly effective nanocoatings, such as anti-corrosion or insulation coatings, help to achieve desired attributes and to prevent undesired side effects. PlasmaPlus technology is used to apply nano coatings on different surfaces with different functionalities.

SGET e.V. has announced the release1.0 of the new OSM Computer-on-Module standard. OSM, which is short for Open Standard Module, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new achievement in the miniaturisation of modular COM/carrier designs, replacing credit card-sized modules with postage stamp-sized ones.

Since 2018, DELO has saved 3,200 tons of carbon dioxide with a new solution for shipping adhesives. This was achieved with shipping containers that work according to the thermos flask principle. Adhesives enable lightweight design and resource-saving miniaturisation. For technical reasons, many high-tech adhesives have to be transported refrigerated or frozen.

Insight SiP has announced the signature of a distribution agreement with Steliau Technology, distributor of electronic components in the French market. This new agreement allows Steliau Technology to enlarge its portfolio by proposing RF modules with integrated antennas and combining several technologies: UWB / BLE and LoRa / BLE.

Würth Elektronik has announced that it now offers developers wanting to use WE-MCA series chip antennas a free matching service. WE-MCA are compact SMT-mountable multilayer ceramic chip antennas available in numerous single and dual band versions.

When it comes to switching solutions, contemporary automotive application design resorts more and more to PCB mounted products. The primacy of miniaturisation and efficiency without compromises in terms of reliability and performance render THT or PiP mounted relays a perfect solution for multiple high current loads.

A global distribution agreement has been signed by Mouser Electronics and SanRex, a manufacturer of highly engineered, reliable power semiconductors.

NXP Semiconductors and NEC have announced that NEC selected NXP to supply RF Airfast multi-chip modules to be used in a Massive MIMO 5G antenna Radio Unit (RU) for Rakuten Mobile. NEC’s Massive MIMO 5G antenna RU features a 5G open virtual radio access network (vRAN) interface and has been adopted by Rakuten Mobile for its fully virtualised cloud-native mobile network.

Step by step, autonomous driving is increasingly becoming a feature of our mobility. With each step, ever-larger data volumes need to be processed fast to allow quick reactions to any given situation. AT&S is developing a robust and resilient interconnect concept for a high-performance computer chip.