Search results for "miniaturisation"

At the 2021 SPIE Advanced Lithography Conference, imec demonstrated the capability of directed self-assembly (DSA) to pattern line/spaces with a pitch as small as 18nm, using a high-chi block copolymer (high-χ BCP) based process under high volume manufacturing (HVM) conditions.

Artificial Intelligence (AI) is on the cusp of becoming an irreplaceable tool in a wide range of fields, such as working from home, avionics, telecommunications and defence. The latest frontier in this development is ruggedisation and miniaturisation. Here, Andy Conway, Sales Manager at Embedded Computing Specialist Recab UK, reflects on the unpredictability of the inventions that led to the breakthroughs behind AI.

When it comes to selecting memory storage for new applications, design engineers and product developers seemingly have a wealth of storage choices at their fingertips. Bruno Trematore, Chief Engineer, Kioxia explains more.

ams has launched the TMD2636, a fully integrated proximity sensor which reportedly occupies 30% less space than currently available solutions, and so delivers trans-formational added value to manufacturers of True Wireless Stereo (TWS) earbuds.

The end of Moore’s law has been signaled for some time, but without a doubling of the number of transistors, battery-powered mobile devices rely on it to increase computing complexity. Gordon Allan offers a survival guide to life outside Moore’s law

GeneSiC Semiconductor has announced the immediate availability of next-generation 3300V and 1700V 1000mΩ SiC MOSFETs – G2R1000MT17J, G2R1000MT17D, and G2R1000MT33J. These SiC MOSFETs enable high performance levels, based on flagship Figures of Merit (FoM) that enhance and simplify power systems across energy storage, renewable energy, industrial motors, general-purpose inverters and industrial lighting.

CEA-Leti scientists, working with researchers at Politecnico di Milano, have developed the a high-performance gyroscope for operating in severe environments, such as industrial and aeronautic equipment and automobiles. The advancement has proven that it is possible to detect minute rotational movement even among system vibrations.

Doosan Mobility Innovation (DMI) has delivered humanitarian relief to remote locations using drones powered by its innovative energy-dense hydrogen fuel cells. With two hours of flight time, the drones have transported masks and emergency supplies between US Virgin Islands and have delivered medical AEDs to the top of Mt. Hallasan (6,388 ft), the tallest mountain in South Korea located on Jeju Island.

Artificial Intelligence (AI) is on the cusp of becoming an irreplaceable tool in a wide range of fields, such as working from home, avionics, telecommunications and defence. The latest frontier in this development is ruggedisation and miniaturisation. Here, Andy Conway, Sales Manager atembedded computing specialistRecab UK, has reflected on the unpredictability of the inventions that led to the breakthroughs behind AI.

Farnell has strengthened its passive components line up by signing a global franchise agreement with Yageo, extending its existing relationship to give customers access to the full product range.