Search results for "advantest"
Advantest's T2000 8-Gbps Digital Module for High-Speed Testing of SoCs
Advantest has introduced its new T2000 8GDM to address the test requirements of system-on-chip devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate connections. The new module will be featured in Advantest’s exhibit (booth #8C-901 in Hall 8) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.
Advantest Develops EB Lithography System for 1Xnm Node
Advantest has announced that it has developed a new EB (electron beam) lithography system, the F7000, with superior resolution performance meeting the requirements for 1Xnm technology nodes. The F7000 supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes.
Advantest Introduces T2000 IMS for Low-Cost Testing of Integrated Microcontroller and Smart Card ICs
Advantest has introduced its new T2000 Integrated Massive Parallel test solution (IMS), a massive parallel test system capable of achieving the lowest cost of test for microcontroller units with integrated analog and embedded flash memory circuits.
Advantest Develops THz TOF Tomography Analysis System
Advantest Corporation today announced that it has developed a Terahertz (THz) time-of-flight (TOF) tomography analysis system utilizing short-pulse wide-band THz waves. The new system performs imaging and analysis of multi-layer coatings as thin as 10 μm, enabling the analysis of electrode films in li-ion batteries and layers within multi-coat automotive paint, among diverse new applications.
Advantest remporte le Prix du Meilleur Fournisseur remis par STATS ChipPAC
Premier fournisseur de bancs de test pour semiconducteurs, Advantest Corporation s'est vue décerner le Prix du Meilleur Fournisseur par la société STATS ChipPAC Ltd. (SGX-ST : STATSChP), l'un des premiers prestataires en solutions d'emballage, d'assemblage, de tests et de distribution de semiconducteurs. C’est la cinquième année consécutive qu’Advantest est distinguée par cette reconnaissance.
STATS ChipPAC names Advantest as Best Supplier
Advantest has today announced that it has received a Best Supplier Award from Singapore-based STATS ChipPAC. This is the fifth consecutive year that Advantest has earned this supplier accolade. STATS ChipPAC’s Best Supplier Award recognizes materials and equipment suppliers for overall best-in-class performance in cost, quality, delivery, technology, service and support.
500th V93000 Port Scale RF Tester shipped by Advantest
Advantest has announced today that it has installed its 500th V93000 Port Scale RF test system, with the landmark unit going into the engineering development laboratory of Spreadtrum Communications. Spreadtrum has begun using the versatile tester, which is equipped with both a Pin Scale 1600 digital card and a MB-AV8+ analog card, to develop semiconductor products for mobile phone applications, including RF-based system-on-chip and 3G baseband de...
Advantest and JEM Receive Best Overall Presentation Award at IEEE SWTW 2012
Advantest Corporation declared today that the company received the Best Overall Presentation Award at the 22nd Annual IEEE Semiconductor Wafer Test Workshop for a joint presentation with leading probe card manufacturer JEM. SWTW 2012 was held June 10 - 13, 2012, in San Diego, CA, USA.
Advantest Introduces Industry’s Highest Capability 3-in-1 Semiconductor Test Clock Module to
Advantest Corporation have introduced the new T2000 LJC16 16-channel, low-jitter-clock module. The LJC16 module, which combines different digital clock and analog clock/sine-wave requirements in a single high-multi-site system, will be featured in Advantest’s booth (#6247 in North Hall) at the SEMICON West trade show, July 10-12 in San Francisco.
Advantest Breaks Ground for Cheonan, S. Korea Factory
Advantest today announced that its South Korean subsidiary, Advantest Korea broke ground on June 28 for its new factory in Cheonan City, Chungnam Province, South Korea.