Search results for "advantest"
Advantest Develops THz TOF Tomography Analysis System
Advantest Corporation today announced that it has developed a Terahertz (THz) time-of-flight (TOF) tomography analysis system utilizing short-pulse wide-band THz waves. The new system performs imaging and analysis of multi-layer coatings as thin as 10 μm, enabling the analysis of electrode films in li-ion batteries and layers within multi-coat automotive paint, among diverse new applications.
New Cross Domain Analyzer Enables Interference Analysis up to 43 GHz in a Single Box
Rohde & Schwarz completes its own substantial portfolio in Spectrum and Signal Analyzers by the new U3800 2-channel Vector/Spectrum Signal Analyzer from Advantest. Introducing this powerful measurement tool the company addresses the dramatically increasing information traffic which leads to the more effective use of the available frequency resources, new transmission technologies, multi-use frequencies and intelligent routing techniques.
Advantest Introduces T5511 High-Speed Memory Test System Offering Multi-functionality and Industry’s Top Test Speed of 8Gbps
Advantest Corporation announced the availability of its next-generation high-speed DRAM test system, the T5511. The new system, which begins shipping this month, offers the industry’s fastest test speed of 8Gbps.
Advantest Announces 3D TSV Stack Test Solutions
Advantest Corporation today announced that a new product line of fully automated and integrated test and handling solutions for TSV based 2.5D and 3D products is under development. The concept model test cell dubbed, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.
Advantest and JEM Receive Best Overall Presentation Award at IEEE SWTW 2012
Advantest Corporation declared today that the company received the Best Overall Presentation Award at the 22nd Annual IEEE Semiconductor Wafer Test Workshop for a joint presentation with leading probe card manufacturer JEM. SWTW 2012 was held June 10 - 13, 2012, in San Diego, CA, USA.
STATS ChipPAC names Advantest as Best Supplier
Advantest has today announced that it has received a Best Supplier Award from Singapore-based STATS ChipPAC. This is the fifth consecutive year that Advantest has earned this supplier accolade. STATS ChipPAC’s Best Supplier Award recognizes materials and equipment suppliers for overall best-in-class performance in cost, quality, delivery, technology, service and support.
Advantest Ships 100th V93000 Smart Scale Test System in Product Line’s First 10 Months
Just ten months after launching its Smart Scale generation of testers, Advantest Corporation has shipped its 100th V93000 Smart Scale system, capable of scalable, highly cost-efficient testing of IC designs for the 28 nm technology node and beyond.
Advantest Announces Memory Test System T5811
Advantest Corporation today announced its new memory test system, the T5811, targeting DRAM memory core test. Available from July 2012, the T5811 reduces power consumption by 90% and floor-space requirements by two-thirds, compared to previous models, and is upgradable via a simple exchange of components.
Advantest Introduces Industry’s Highest Capability 3-in-1 Semiconductor Test Clock Module to
Advantest Corporation have introduced the new T2000 LJC16 16-channel, low-jitter-clock module. The LJC16 module, which combines different digital clock and analog clock/sine-wave requirements in a single high-multi-site system, will be featured in Advantest’s booth (#6247 in North Hall) at the SEMICON West trade show, July 10-12 in San Francisco.
500th V93000 Port Scale RF Tester shipped by Advantest
Advantest has announced today that it has installed its 500th V93000 Port Scale RF test system, with the landmark unit going into the engineering development laboratory of Spreadtrum Communications. Spreadtrum has begun using the versatile tester, which is equipped with both a Pin Scale 1600 digital card and a MB-AV8+ analog card, to develop semiconductor products for mobile phone applications, including RF-based system-on-chip and 3G baseband de...