Search results for "tsmc"

The Sensor + Test exhibition in Nuremberg provided the platform for Pyreos to unveil its ezPyro TO flame sensor with a digital interface. It offers longer distance detection and an impressive field of vision exemplified by CEO Andrew Wallace using a lighter flame virtually sideways on from a distance of six feet and still drawing a response from the sensor.

Dolphin Integration has augmented TSMC’s IP ecosystem at 40nm with TITAN, an architecture for Read Only Memory compiler. This single-layer and late programmable ROM compiler is capable of generating instance sizes from 512bits to 1Mbits. It is available for evaluation on your private space, MyDolphin.This 40nm ULP eFlash ROM compiler, based on the TITAN architecture, combines high-density with ultra-low power consumption.

40 years ago a team of engineers at Plessey Semiconductors decided it was time for a change. They headed off into the unknown and founded Swindon Silicon Systems, which stands out now as one of the few UK-based semiconductor companies still operating.

UltraSoChas announced thatAndes Technologyhas adopted UltraSoC’s advanced embedded analytics technology for use in its AndesCore range of RISC-V processors. Andes will leverage UltraSoC’s Intellectual Property (IP) offering, including the commercial RISC-V processor trace solution, to accelerate development and enhance debugging of embedded products for sophisticated applications including AI, computer vision, network controllers, and...

Xilinx has announced a new product category called Adaptive Compute Acceleration Platform (ACAP) that goes far beyond the capabilities of an FPGA. An ACAP is a highly integrated multi-core heterogeneous compute platform that can be changed at the hardware level to adapt to the needs of a wide range of applications and workloads. An ACAP’s adaptability, which can be done dynamically during operation, delivers levels of performance and perfor...

Rockley Photonics has announced that it is demonstrating its in-package-optics platform to select customers and development partners. Rockley has developed the world’s first single-chip L3 routing switch to directly integrate 100G network ports using single-modefibre.Leveraging Rockley OpticsDirecttechnology, this platform is among the first of its kind to integrate high-speed optical interconnect with high-scale CMOS digital and mixed-sign...

Research has shown that the ten largest semiconductor R&D spenders increased their collective expenditures to $35.9bn in 2017, an increase of six percent compared to $34.0bn in 2016. Intel continued to far exceed all other semiconductor companies with R&D spending that reached $13.1bn.

In order to accelerate software development for the ARC HS processor family,Synopsys has announced availability of the DesignWare ARC HS Development Kit. The ARC HS Development Kit is a ready-to-use software development platform that includes access to the embARC open source software packages on the embARC website, enabling designers to start software development prior to SoC availability.

At the International Electron Devices Meeting (IEDM), imec reported ultralow contact resistivity of 5x10-10Ωcm2 on Gallium (Ga)-doped p-Germanium (Ge) source/drain contacts. The low contact resistivity and high level of Ga activation were achieved after nanosecond laser activation (NLA) at low thermal budget. The results show that highly Ga-doped Ge-rich source/drain contacts provide a promising route for suppressing parasitic source/drain resi...

At the 2017 International Electron Devices Meeting (IEDM), imec, research and innovation hub in nano-electronics and digital technology, presented the first Power-Performance-Area-Cost (PPAC) analysis of different sequential 3D-integration variants using advanced 5nm and 3nm CMOS technology nodes.