Search results for "advantest"
Cloud testing has a DATE in Grenoble
Advantest will showcase its CloudTesting solutions from its group company, Cloud Testing Service at DATE 2015 at the ALPEXPO-ALPES Congress in Grenoble (March 9-13). Backed by Advantest’s 60-year history of measurement technology and innovation, CTS solutions offer the latest high-quality test methods utilising IPs, characterization tools, analysis and more.
Handler enables memory testing productivity gains
Advantest has combined improved positioning accuracy higher throughput and tighter temperature control in its new M6245 test handler. The system incorporates the company’s latest advances for handling double data rate (DDR) and Flash memory devices. The test handler incorporates a visual-alignment system that improves test yields by achieving contact accuracy to within 0.3 mm ball pitch.
PMU module improves high-level measurement accuracy
Advantest has launched a new multi-purpose parametric measurement unit (PMU) module, the T2000 PMU32E, to enhance its T2000 platform’s capabilities in testing digital, analogue and power-management system-on-chip (SoC) devices. The new high-density, 32-channel module is fully compatible with Advantest’s original PMU32 module – even using the same tester interface unit (TIU) – while offering twice the resolution and accurac...
Tester addresses advanced display driver IC trends
There are three key trends in testing the next generation of display driver ICs that control high resolution LCD panels, and Advantest has launched its new T6391 system to meet these requirements. The new tester will address the growing number of pins on display driver devices, the increasing speeds of interfaces and highly integrated multi-functions – all of which contribute to higher resolution displays.
Let your voice be heard at VOICE
Advantest is once again offering engineers and designers the chance to participate at its VOICE 2015 annual Advantest Developer Conference. The test equipment supplier has issued an international call for papers focusing on innovative test solutions for system-on-chip (SoC) and memory semiconductor devices and handler solutions.
E-beam lithography tool debuts at Semicon Europa
Advantest is preparing to exhibit its broad portfolio, including its nanotechnology products, terahertz systems and semiconductor test solutions at SEMICON Europa in Grenoble (October 7-9). It will highlight its multi-vision CD-SEM metrology solutions and newest e-beam lithography tool.
Metrology system analyses semiconductor packaging
Advantest has a new mold thickness metrology system, the TS9000, for measuring the thickness of semiconductor packaging. The system is based on advances in Terahertz (THz) technology pioneered by Advantest. The TS9000 Mold Thickness Analysis (MTA) System is a new metrology tool that performs non-destructive analysis of the thickness of semiconductor packaging.
Engineering station enhances SSD test support
Advantest has added to its MPT3000 family for testing advanced solid-state drives (SSDs) by launching the MPT3000ES engineering station. The new station features a small footprint configured to test up to eight SSDs in parallel. The system’s small size and ability to plug into a standard AC outlet enable users to conduct program development and interactive device debugging in either office or lab settings.
Floating power source opens way to test high voltage ICs
Advantest has extended the capabilities of its V93000 test platform for high-voltage and high-current testing of embedded power devices. It has launched the PVI8 floating power source, which gives the V93000 sufficient power and enough analogue and digital channels on a single platform to conduct highly parallel, cost-efficient testing of embedded power ICs.
Test module handles MPUs, ASICs, FPGAs
Advantest has announced its new T2000 Enhanced Device Power Supply 150A (DPS150AE) module that enables its T2000 test platform to handle the load requirements for highly accurate testing of both high-current and low-voltage semiconductors, including microprocessor units (MPUs), application-specific ICs (ASICs) and field-programmable gate arrays (FPGAs).