Search results for "tsmc"

Xilinx showed a range of new products to leverage AI applicationsat an event in Frankfurt, Germany.Speakersat the eventincluded Ivo Bosens, Xilinx CTO, and KirkSaban, Xilinx VP ofProduct andTechnicalMarketing.

It has been announced by Synopsys, that Innovium has adopted the Synopsys IC Validator tool for physical signoff. Innovium deployed IC Validator on their flagship 12.8Tbps throughput TERALYNX switch. To meet their aggressive time-to-market schedule, Innovium used IC Validator across more than 250 CPU cores to take advantage of IC Validator's performance scaling.

At the 2018 IEEE International Electron Devices Meeting (IEDM), imec, and its partners presented an experimental demonstration of full majority gate operation based on spin-wave interference in scaled devices. Circuit-level benchmarking recommends majority gates based on spin-waves for ultralow power applications.

Micron Technology has announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC 7nm process technology.

The November Update from IC Insights’ to the 2018 McClean Report, includes a discussion of the forecasted top-25 semiconductor suppliers in 2018 (the top-15 2018 semiconductor suppliers are covered in this research bulletin). The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments, and average selling price).

Enabling a new era of rapid innovation for any application by any developer, Xilinx, Inc. CEO Victor Peng unveiled Versal – the industry's first adaptive compute acceleration platform (ACAP). Versal ACAPs combine Scalar Processing Engines, Adaptable Hardware Engines, and Intelligent Engines with leading-edge memory and interfacing technologies to deliver powerful heterogeneous acceleration for any application.

Adaptive and intelligent computing company, Xilinx, has announced the availability of its Defence-grade XQ UltraScale+ portfolio of products, providing the benefits of its UltraScale+ architecture plus extended temperature and ruggedised packages to address the needs of the aerospace and defence industry.

Cadence announced its continued collaboration with TSMC to certify its design solutions for TSMC 5nm and 7nm+ FinFET process technologies for mobile and high-performance computing designs. As part of the collaboration, the Cadence digital, signoff and custom/analog tools have achieved the latest Design Rule Manual and SPICE certification for the TSMC 5nm and 7nm+ processes, and the corresponding process design kits are now available for download....

The average revenue generated from processed wafers among the four biggest pure-play foundries (TSMC, GlobalFoundries, UMC, and SMIC) is expected to be $1,138 in 2018, when expressed in 200mm-equivalent wafers, which is essentially flat from $1,136 in 2017, according to a new analysis by IC Insights.

It has been announced by Synopsys, that the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies. The design platform enablement is combined with the 3D-IC reference flow.