Search results for "soldering"

Manufacturers of solar panel modules can increase their productivity with a new type of junction box from Multi-Contact. Called the Foxbox, the compact box has been designed for use in the automated assembly of polycrystalline photovoltaic (PV) arrays.

NXP Semiconductors announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads. The SOD882D is a 2-pin plastic package measuring only 1mm x 0.6mm and is ideal for small and thin devices. With a height of only 0.37 mm (typical), it is also one of the flattest packages in the 1006-size (0402 inch) and is available in various ESD protection and switching diodes.

020200MB005XX32ZX...Here's a part number that's bigger than the product!!! For space-critical applications in which every square millimeter is crucial, SUYIN offers a particularly sophisticated solution in the form of its new 020200MB005XX32ZX 5-pin Mini USB female connector. Due to its shape, it is possible to place small components (such as chip capacitors or chip resistors) on the PCB beneath a portion of this right-angle, surface-mount, type...

The new M12 receptacle connectors from Belden's Lumberg Automation product range can be used to connect control units to ProfiNet/Profibus networks via bus modules as well as to transmit analog data at field level. Integrated shielding between devices brings a high level of functional reliability. The receptacle connectors are available with assembled control cables or with printed contacts for PCB mounting.

The new 4-pole battery connector 080623GA from Taiwanese connector specialist SUYIN offers a compact, super-flat design and can be used in a broad variety of applications. The housing of the vertical SMT connector provides a height of only 1.3mm.

SUYIN’s 020200MA005XX56XX series offers a type-B, 5-pin Mini USB receptacle for surface mounting that is specially designed to meet the requirements of consumer products. At the same time, however, due to its particularly robust construction, it is also well suited for use in industrial automation tasks.

KIC announces that Martin Lopez will discuss how to fix reflow- and wave-related defects as well as how to avoid them at the upcoming Technical Forum, hosted by the SMTA Guadalajara Chapter, scheduled to take place November 9-10, 2011 at the Centro de Enseñanza Tecnica Industrial (CETI) Auditórium in Guadalajara, Jalisco.

Infineon Technologies announced its new SLI 76 “in Car” family of microcontrollers for the use in automotive Machine-to-Machine (M2M) systems. They are the industry’s first UICC (Universal Integrated Circuit Card) microcontrollers that are qualified by the stringent processes of the Automotive Electronics Council (AEC) Q100 quality standard. The SLI 76 “in Car” chips offer long lifetime, high data retention, extended temperature range, ...

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a 30V Power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with the world’s lowest R DS(on) for high current automotive applications. The new OptiMOS™-T2 30V MOSFET is a N-channel device with drain current of 180A and R DS(on) of just 0.9mΩ at 10V gate-to-source voltage. The IPB180N03S4L-H0, which comes in a D2PAK-7 package, addresses customer needs for Powe...

As demand for increasing quality, lifetime and environmental resilience is placed on electronics PCBs in greater volume and wider applications, conformal coating is now typically a standard process rather than an exotic special treatment. It must therefore deliver its full protection potential without compromising mainstream PCB assembly throughput or quality. Andy Bonner of YESTech Europe looks at how techniques drawn from AOI/AXI inspection exp...