Search results for "soldering"

MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Wisconsin/Great Lakes Expo and Tech Forum, scheduled to take place August 24, 2010 at the Wyndham Airport Hotel in Milwaukee, WI.

Torenko and Associates, announces that Jochen Lipp, CEO of IBL Technologies, will hold a Vapor Phase Solder seminar and onsite demonstration at the upcoming SMTA Houston Chapter meeting. The meeting is scheduled to take place Thursday, August 19, 2010 from 6-9 p.m. at TS3 Technology, Inc. in Stafford, TX. Torenko and Associates represents IBL Technologies in Texas and Mexico.

JBC Tools announces that Productronica 2011 (the International Trade Fair for Innovative Electronics Production), which took place in Munich, Germany was a great success for JBC Soldering. JBC Tools displayed several new world-class products including the “JBC Touch,” which drew a great deal of interest because of the features the unit incorporates and the ease of use of its touch screen display. Apart from the high-resolution screen ...

Circuit Technology Inc., an IPC master training organization, announces the launch of its redesigned Web site