Search results for "thermal"
Direct Insight announces lowest price SoM with STM32MP1
Direct Insight, the UK-basedtechnical systems integrator and reseller of system-on-module (SoM)and other embedded systems, can now deliver tiny, low-cost QSMP-13 solder-down QFN-style System-on-Module SoMs featuring the STMicro STM32MP135C.
Utilising new materials to combat flexible e-waste
Electronic waste, commonly known as e-waste, represents an escalating global challenge, with projections indicating it will worsen as new flexible electronics for robotics, wearable devices, health monitors, and other innovative applications, including single-use devices, continue to be developed.
HighPoint SSD7749M2: a new high-density AIC
HighPoint has unveiled its new high-density AIC featuring 16x M.2 Ports NVMe RAID AIC; the SSD7749M2.
TTI Europe will be at Cenex Expo
TTI IP&E – Europe, a distributor of electronic components, alongside its recent acquisition Raffenday, will present an extensive range of interconnect technologies and cable harnesses for low-carbon vehicles at this year’s Cenex Expo.
Bourns’ IEC Class I and Class II AC SPDs
Bourns’ has announced its new Model 1270 and 1280 Series Din-Rail AC Surge Protective Devices (SPDs) are IEC/EN 61643-11 compliant Class I + Class II / T1+T2 SPDs, and Model 1280 features an Advanced Thermal Disconnector (TD+) for enhanced protection that eliminates the need for upstream overcurrent protection. Both model series also feature a window fault indicator and remote alarm to help monitor the operating status of the surge protecto...
Pulsiv release the world’s most efficient 65W USB-C design
Pulsivhas unveiled a 65W USB-C GaN optimised reference design, which claims to be among the world’s most efficient.
EPC and Anglia team up for GaN webinar
EPC and Anglia Components are partnering to present a free webinar on GaN basiscs and applications.
Arrow Electronics & NeuReality advanced AI inferencing
Arrow Electronics supported the development of the world’s first 7nm Network Addressable Processing Unit (NR1 NAPU) housed in the complete NR1-S AI Inference Appliance from NeuReality – delivering competitive advantages in cost and power savings versus traditional CPU-centric architecture.
SweGaN secures multiple major frame agreements
SweGaN has reported orders for its benchmark QuanFINE epiwafers worth 17 MSEK in the first half of 2024, including three large frame agreements from undisclosed major telecom and defence market players.
Infineon’s CIPOS Maxi modules for 4kW motor drives
Infineon Technologies expandsits 7th generation TRENCHSTOP IGBT7 product family with the CIPOS Maxi Intelligent Power Module (IPM) series for low-power motor drives.