Search results for "thermal"

Bicker Elektronikpresents the new BEA-551K, a powerful 500W industrial PC PSU for stable ATX power supply of motherboards with the latest processor generation Intel Core.

Nexperia has unveiled an expansion of its range of power bipolar junction transistors (BJTs), introducing ten standard and ten automotive-qualified products housed in DFN2020D-3 packaging.

HighPoint has announced the launch of the RocketAIC 7749M2 product series, a line of NVMe storage drives designed for professional workstations and server platforms that accommodate high-performance, data-intensive workloads.

The National Physical Laboratory (NPL) has developed a state-of-the-art thermal imaging technology aimed at enhancing the early detection and treatment of diabetic foot ulcers.

As a innovator in materials for cutting-edge technologies, Indium Corporation is set to highlight its advanced heterogeneous integration and assembly (HIA) products, along with thermal interface materials (TIMs) driving AI progress, at SEMICON Taiwan from September 4-6 in Taipei.

Rutronik is broadening its MOSFET range with the introduction of Infineon's CoolMOS 8 series, building on the success of the 600 V CoolMOS 7 MOSFET family, which includes the P7, S7, CFD7, C7, G7, and PFD7 variants.

Alpha and Omega Semiconductor has announced its new highly robust power MOSFET LFPAK 5x6 package.

Paige West speaks with Orr Danon, CEO & Co-Founder, Hailo about theirrecent partnership with Raspberry Pito enable advanced AI capabilities for the Raspberry Pi 5.

xMEMS Labs have unveiled its latest groundbreaking innovation: the xMEMS XMC-2400 µCooling chip. This is the industry’s first all-silicon, active micro-cooling fan, designed for ultramobile devices and next-generation artificial intelligence (AI) applications.

With wide bandgap semiconductors like Gallium Nitride (GaN) and Silicon Carbide (SiC) growing in popularity, it begs the question: GaN or SiC?