Search results for "advantest"
Complete solution for measuring the dimensions of nanoscale patterns
Complete solution for measuring the dimensions of nanoscale patterns introduced byAdvantest and Digital Surf. They have announced that PM3D Map software based on Digital Surf’s industry-standard Mountains Technology is now incorporated into the company’s leading-edge Multi Vision Metrology Scanning Electron Microscope (MVM-SEM) series. Advantest’s MVM-SEM system together with PM3D Map software now provide a complete solution for...
Die-level handler tests ICs for high-growth applications
The HA1000 die-level handler is a cost-efficient test solution for determining known good dies (KGD) prior to IC packaging announced by Advantest. Economics is a driving factor in die-level testing. Determining a semiconductor device’s viability prior to packaging or building memory stacks is critical to avoiding rework, achieving high yields and lowering costs.
San Diego & Taiwan host semiconductor test conference
Dual sessions in the United States and Asia will be key features of Advantest’s 10th annual VOICE Developer Conference. Key players in the semiconductor test industry will get opportunities to hear more than 120 technical presentations, talk with experts at technology kiosks, visit the Partners’ Expo, attend networking events and conduct in-depth discussions relating to Advantest’s broad range of IC test solutions.
Test developer conference celebrates 10th anniversary
VOICE, the annual developer conference hosted by leading semiconductor test equipment supplier Advantest will celebrate its 10th anniversary in May with a comprehensive line-up of more than 120 technical presentations, technology kiosks, a Partners’ Expo, multiple networking events and opportunities for in-depth discussions about Advantest’s test platforms as well as handlers, test cell solutions and related technologies.
Versatile tester targets wide range of flash memories
The new T5830 memory tester is the latest member of Advantest’s T5800 product family, optimised for testing a wide range of flash memory devices used in mobile electronic devices. As portable applications are booming, the global market for flash-memory test systems is projected to reach $148 million by 2018, according to market analysis firm VLSIresearch.
Test solutions take the road to Shanghai
Test solutions for measuring the connected world – and everything in it – will be demonstrated by Advantest at the SEMICON China trade show in Shanghai (March 15-17). In addition to exhibiting, Advantest is sponsoring two events at the show - the Build China IC Manufacturing Ecosystem Forum and the China Semiconductor Technology International Conference (CSTIC).
Analogue pin module tests SoCs for IoT & mobiles
The DC Scale AVI64 module from Advantech is designed to give the V93000 single scalable platform the broadest application coverage on the market. Using Advantest’s innovative universal analog pin architecture, the 64-channel module extends the V93000 platform’s capabilities to include testing of power and analog ICs that enable smart, internet-connected electronics for the rapidly growing mobile, automotive and Internet of Things (IoT...
Tokyo date for pressure sensor test unit
The new HA7200 temperature and pressure stimulus unit, designed to apply the precise temperature and pressure required for final testing of pressure sensors has been unveiled by Advantest. Up to four sensors can be tested in a small chamber with the temperature controlled by the dual-fluid technology used on Advantest’s test handlers.
Debut makers lined up for SEMICON Japan
Advantest will have a prominent presence at the SEMICON Japan trade show (December 16-18) at the Tokyo Big Sight international exhibition centre. In addition to showcasing a wide spectrum of automatic test equipment (ATE) and presenting a technical paper, Advantest is a gold sponsor of this year’s event, which includes sponsoring the President’s Reception on December 16.
Tester takes on high performance flash devices
The T5851 system is designed to provide a cost-effective test solution for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives (SSDs) – memory ICs in high demand by makers of low-power, mobile applications such as smart phones, tablets and ultra-portable laptops.