Search results for "tsmc"

Stellantis and Infineon have announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.

Paige West speaks with Rob Moffat, Deputy Director Sales & Business Development Europe at MediaTek about the role of semiconductors in the future of mobile gaming innovation.

Advantest will feature its latest test solutions for advanced ICs at the 2024 International Test Conference (ITC) at the Hilton San Diego Bayfront (November 3-8).

Omdia’s Display Driver IC Market Tracker indicate that NexChip and Samsung Foundry have emerged as key leaders in the display driver IC (DDIC) market for 3Q24.

Alphawave Semihas announced the availability of the industry's first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem.

NVIDIA has announced the results of the recent MLPerf Inference v4.1 for its new Blackwell and Hopper architecture, showing strong results.

Breaking the high-end packaging market down by end markets, the largest segment is telecom and infrastructure, which accounted for over 67% of the revenue in 2023.

Cadence Design Systems has announced that it has won four Open Innovation Platform (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.

Synopsys has been selected as a TSMC Open Innovation Platform (OIP) Partner of the Year, earning five awards spanning digital, analog, multi-die system, radio frequency (RF) design, and interface IP.

Socionext announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and edge-of-network markets.