Search results for "soldering"
Gowanda is First in Industry to Offer 0603/0805 QPL RF Chip Inductors
Gowanda Electronics announced that the company recently achieved qualification to the military’s MIL-PRF-83446 (/36A and /37A) for its ML0603 and ML0805 series of RF surface mount wirewound ceramic core chip inductors. These are the first series in the industry to address the market need for Qualified Product List (QPL) inductors which meet this particular Department of Defense specification.
Blakell Europlacer Announces CPI expansion in Rotherham
In 1997, Paul and Val Ironmonger established CPI to assist clients in their product design across such markets as tobacco, control & instrumentation and commercial to name but a few.Using their extensive knowledge and expertise in electronic product design and manufacture, CPI have always been at the forefront of technology, embracing such ideas as CAD/CAE and advanced manufacturing techniques.
Kyzen to Debut New Advanced Packaging Cleaning Chemistry at NEPCON South China 2011
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will introduce AQUANOX A4638 ― its newest advanced packaging cleaning chemistry ― in booth 1J50 at the upcoming NEPCON South China 2011 exhibition and conference. The event is scheduled to take place August 30-September 1, 2011 at the Shenzhen Convention & Exhibition...
Serge Tuerlings Presented to Captive Audience during IPC Conference in Budapest
Kyzen successfully presented at the recent IPC Conference on Electronics Assembly: Soldering, Assembly and Inspection in Budapest, Hungary. This is the second, consecutive year that Kyzen presented at this event and their topic, “Cleaning Highly Dense Circuit Assemblies”, generated a lot of interest on the importance of cleaning in the electronic manufacturing process.
BTU International Recognized with Its Sixth Innovation Award from EM Asia
BTU International, Inc. announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Reflow Soldering Equipment for its PYRAMAX 100N convection reflow oven. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China.
Reinard Nitz of pb tec Receives MIRTEC Europe’s President’s Award
MIRTEC announces that Reinhard Nitz of pb tec was proudly presented with Mirtec Europe’s President’s Award at its recent European Sales Meeting in Hanau, Germany.
Finetech Announces a New Partnership Agreement for UK and Ireland
Finetech is delighted to announce a new partnership with Gen3 Systems. With over 40 years of experience, Gen3 Systems is a globally operating original equipment manufacturer as well as specialist distributor.
Professional Solutions for Hot Air SMD Rework
From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.
Rutronik presenting the new R0.25S series from RECOM
Rutronik has upgraded its portfolio with the new R0.25S series from RECOM in open frame SMD design with improved efficiency and extended ambient temperature. The compact 0.25W single output converters can be used in many industrial low power applications and are also approved for medical applications.
Essemtec Builds Printer For 180x50cm
Essemtec will build a production line for LED tubular lamps that will replace the common fluorescent lamps. Essemtec's innovation, a 180x50cm printing system will enable the full automatic, inline production of such lamps.