Search results for "soldering"
IPC Midwest Soldering Competition sponsored by Colbar
Balver Zinn has today announced that Cobar Solder will be sponsoring and participating in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and wire as well as high-performance fluxes and other related soldering materials in Booth #809.
SEHO Receives a 2012 Innovation Award for Its New AOI Feature for Selective Soldering during NEPCON China
SEHO Systems GmbH announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Soldering Systems – Auxiliary for the new AOI function for its best-selling selective soldering system – the SEHO PowerSelective. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China.
SEHO Systems to Highlight PowerSelective Soldering System at NEPCON China 2012
SEHO Systems GmbH announces that it will exhibit PowerSelective soldering system in booth #1A87 at the upcoming NEPCON China 2012. The event is scheduled to take place April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.
AIM’s Karl Seelig to Discuss Lead-Free Alloy Development at ICSR 2012
AIM announces that Karl Seelig, Vice President of Technology, will present at the upcoming International Conference on Soldering & Reliability (ICSR), scheduled to take place May 16-18, 2012 at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada. The presentation titled “Lead-Free Alloy Development” will take place Friday, May 18, 2012 at 8:45 a.m.
Christopher Associates’ Jasbir Bath to Present “An Investigation into Low Silver Lead-Free Alloy Solder Paste” at SMTA International 2011
Christopher Associates/Koki Solder announce that Jasbir Bath, Consulting Engineer, co-authored the paper titled “An Investigation into Low Silver Lead-Free Alloy Solder Paste for Electronics Manufacturing Applications,” which will be presented at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 16-20, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held d...
Christopher Associates’ Products and Technologies on show at the 2011 Assembly & Automation Technology Expo
Christopher Associates Inc. announces that it will exhibit in Booth #658 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL. Christopher Associates will exhibit the latest equipment and materials from its world-class suppliers, including:
JBC Tools Appoints Chris Cleland as West Coast Regional Sales Manager
JBC Tools, Inc., a leading provider of hand soldering and rework tools, announces the appointment of Chris Cleland as West Coast Regional Sales Manager.
STI Electronics, Inc. Appoints Julio Estrada as a Technical Instructor/Trainer for TX, OK, AR Region
STI Electronics, Inc. has appointed Julio A. Estrada as its newest Instructor for the TX, OK, AR area. “It is easy to see why Mr. Estrada found his true calling as a trainer. He has a great passion to help people understand the government and industry standards. Julio will be a significant addition to the STI training staff,” commented David Raby, President/CEO. “Additionally, he is bilingual and will allow STI to better serve its Hispanic ...
AVX develops miniature wideband coupler with high directivity for wireless applications
AVX Corporation has developed a new wideband directional coupler with high directivity. Based on thin-film multilayer technology, which provides the miniature part with excellent frequency performance and rugged construction for reliable automatic assembly,
SMD isotropic antenna for KES
PREMO has developed a new electromagnetic 3D-coil antenna initially designed for KES applications. The new series 3DC14AOI Passive Entry System has revolutionized in recent years the vehicle opening systems to become standard within the automotive industry. The key new designs increasingly require lower profiles and more robust parts to electrical and mechanical (up to 1000 drops from more than 1 m on concrete surface).