Search results for "microelectronics"
Indium Corporation to feature products for HIA and SiP at IMAPS Boston
Specialist in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications.
SEMICON Taiwan spotlights advanced manufacturing, heterogeneous integration, sustainability and talent
SEMICON Taiwan 2022 gathers industry leaders and visionaries to discuss the latest innovations and trends driving microelectronics industry growth.
ASMPT semiconductor solutions at electronica 2022
At this year’s electronica trade fair in Munich, ASMPT exhibited for the first time under its consolidated brand in Europe, as the company’s Semiconductor Solutions (SEMI) unit showcased its position in the area of mainstream and advanced equipment for semiconductor assembly and packaging with great success.
Miniaturised components of Fraunhofer IPMS – MEMS & Imaging Sensors Summit 2022
Highly sensitive electronic components are the drivers of our digitalised world. Micro-electro-mechanical systems (MEMS) open up new possibilities for miniaturisation in wide-ranging application areas.
Electronic grade silicon swiftly advancing in semiconductor industry
According to Fact.MR, a market research and competitive intelligence provider, the global electronic grade silicon market is valued at $3.8bn and is expected to progress at a CAGR of 5.8% through 2032.
Electronic Specifier presents the Cyber Security forum at electronica
Electronic Specifier is once again looking forward to hosting the Cyber Security forum at electronica this year!
Industrial electronics: an enabler of the digital transformation
Industry 4.0 is among the megatrends of the present day. Its goal is to digitalize and network production along the entire value chain using intelligent industrial electronics and the most up-to-date communication technologies.
Global 200mm semiconductor fab capacity to surge 20%
Semiconductor manufacturers worldwide are estimated to increase 200mm fab capacity 20% from 2021 through 2025, adding 13 new 200mm lines as the industry reaches a record high of more than seven million wafers per month (wpm), SEMI announced in its 200mm Fab Outlook to 2025 report.
Bosch plans €3 billion semiconductor investment
Bosch plans to invest €3 billion in its semiconductor division as part of the IPCEI (Important Projects of Common European Interest) funding program on microelectronics and communications technology.
SEMI announces board members
SEMI has announced at SEMICON West 2022 Hybrid the election of Tim Archer, President and CEO of Lam Research; Doris Hsu, Chairperson and CEO of GlobalWafers Co., Ltd.; and Toshiki Kawai, Representative Director and President and CEO of Tokyo Electron, as new members of the SEMI International Board.