Search results for "microelectronics"
Halo Microelectronics’ powers Samsung’s Galaxy A23 Smartphones
Halo Microelectronics, a maker of analogue and power management integrated circuits enabling energy-efficient smart systems, announced that its HL7132, a 2:1 Charge Pump Direct Charger IC is used on Samsung’s Galaxy A23 smartphones.
element14 community announces winners of the summer of sensors design challenges
element14 challengers utilised sensory kits to create innovative products along four challenge themes
ASMPT launches first European centre of competence for semiconductor solutions
ASMPT has opened its first European SEMI Centre of Competence (CoC) in Regensburg, Germany. This latest facility adds to a network of R&D and innovation facilities across the world, serving European customers as a key proof-of-concept facility for innovations and applications for its broad semiconductor solutions (SEMI) portfolio, and a direct point of contact for the efficient and rapid transfer of knowledge.
SEMICON West makes two big moves – To October in 2024 and Phoenix in 2025
A fixture in the San Francisco Bay Area for more than 50 years, SEMICON West is moving to Phoenix for a five-year annual rotation starting in 2025 and shifting from its longstanding July event dates to October beginning in 2024, SEMI has announced. The event will be held again in Arizona in 2027 and 2029, with all three appearances at the Phoenix Convention Centre.
SEMI Global Smart Manufacturing Conference
Aiming to accelerate the adoption of smart manufacturing across the worldwide microelectronics supply chain, the SEMI Global Smart Manufacturing Conference (GSMC) will gather Industry 4.0 experts, November 8-10th, to share technologies and strategies designed to drive higher product quality, enhance production efficiencies, and improve electronics manufacturing sustainability.
PragmatIC accelerates innovation in smart sustainable manufacturing technologies
PragmatIC announces it is leading a £2.4m project with funding provided by the Made Smarter Innovation: Smart Sustainable Factory Challenge at UK Research and Innovation.
CHIPS Act implementation requires strong focus on 'Advanced Packaging'
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the US government and European Commission are gathering in Washington, D.C. this week to discuss ‘the next big thing’ in CHIPS Act implementation: expanding ‘advanced packaging’ capacities and capabilities to go along with expanding production of semiconductor chips.
electronica 2022: “Anticipation in the industry is high”
electronica, the trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15-18th, 2022.
E-band transceiver targets 5G XHaul applications
Filtronic launched Morpheus X2, the latest generation of its market-leading E-band transceiver for carrier-grade applications in 5G backhaul, midhaul and fronthaul – collectively known as XHaul at European Microwave Week in Milan (September 27-28).
Indium Corporation to feature products for HIA and SiP at IMAPS Boston
Specialist in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications.