Search results for "microelectronics"
2D Experimental Pilot Line offers developers the chance to test graphene-based sensors
The 2D Experimental Pilot Line (2D-EPL), a project grown from the Graphene Flagship, has launched its first customisable wafer run.
Pepping up packaging
GaN semiconductors are relatively commonplace and now the P3EP project moves the spotlight to developing scalable power conversion modules that capitalise on GaN technology for mass manufacturing processes, writes Caroline Hayes.
POLYN and Fraunhofer join forces for European chip project
POLYN Technology and Fraunhofer Mikroelektronik will develop a special process optimisation as a part of POLYN’s next-generation Neuromorphic Analog Signal Processor (NASP) roadmap.
Analogue design: the key to feed our digital world
Milan Ivković, Director Segment Analog/Power & Technical Support Center Manager EBV Elektronik discusses how design engineers can benefit from analogue systems in tandem with the digital world.
Silicon's potential breakthrough for microelectronics
At the heart of all of the technology that powers our world is one element: silicon. It has shaped the course of human evolution, forming integrated circuits and computer processors. But the dawn of a new era of advances in microelectronics may be on the horizon. It is no secret that silicon’s limitations are beginning to rear their heads in R&D labs, leaving many wondering what will replace it. Industrial Journalist Emily Newton discus...
Quantinuum collaboration with JSR explores quantum computing for semiconductor research
Quantinuum, an integrated quantum computing company, has announced a global collaboration with materials technology specialist JSR Corporation of Japan to explore the application of quantum computing methods in semiconductor research.
ASA Initiative and SEMI partner to bolster Microelectronics talent pool
SEMI and the American Semiconductor Academy (ASA) Initiative have announced a partnership to build a comprehensive workforce development program designed to close the microelectronics industry’s widening talent gap.
Double bandwidth for IoT applications with HYPERRAM 3.0
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in semiconductor, microelectronics and IoT solutions, have announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwidth HYPERRAM 3.0.
Solutions for sealed slimline connectors
Advances in modern microelectronics are vital to the latest generation of miniaturised devices. Microprocessors, memory devices and batteries are smaller than ever before. The size and capabilities of modern microprocessors are allowing miniaturised devices to deliver performance that would have required far larger machines.
EM microelectronic low-energy proximity beacon module
Omni Pro Electronics has announced the EM Microelectronics release of its new EMBC22Proximity Beacon Module with Accelerometer for tracking moveable objects.