Search results for "microelectronics"

SEMI Taiwan has launched the SEMI Auto IC Master, a comprehensive guide to automotive semiconductor and component providers in Taiwan. The guide promises to help automakers better adapt production capacity to semiconductor supply chain disruptions and drive innovation.

Foundation partners with CAEL to match worker interests and competencies with educational and career opportunities

FLEX Conference opens next week with keynotes, panel discussions, technical sessions, and product-based demonstrations highlighting the latest innovations in flexible and printed electronics as they continue to re-shape how people work and live.

Additive manufacturing (AM) offers tremendous possibilities for the fabrication of next-generation microelectronic devices, including lower cost and simplicity. Yet, there are several challenges to the widespread use of AM techniques for microfabrication. Łukasz Kosior from XTPL further discusses.

New Melexis 3D magnetic resolver IC is optimized for robust motor design: smallest footprint, programmable at module level, cost-effective and ASIL-ready.

The High Performance Center is addressing the microchip shortage with the combined expertise of four microelectronics institutes of theFraunhofer-Gesellschaft as well as of research groups at universities in Dresden and Chemnitz.

A flagship of semiconductor research with international reach is emerging in Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID are bundling their competences and establishing the Center for Advanced CMOS & Heterointegration Saxony. The center will offer the complete value chain in 300 mm microelectronics, a prerequisite for high-tech research for future technologies.

In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.

Anticipating that 6G systems will offer a major step change in performance from gigabit towards terabit capacities and sub-millisecond response times, the top two European conferences for communication networks will meet June 7-10 to explore future critical 6G applications.

Anticipating that 6G systems will offer a major step change in performance from gigabit towards terabit capacities and sub-millisecond response times, the top two European conferences for communication networks will meet June 7-10 to explore future critical 6G applications like real-time automation or extended reality, an “internet of senses”, sustainability and providing data for a digital twin of the physical world.