Search results for "transistor"
Fairchild Semiconductor’s Smart Gate Driver Optocoupler Enables Simpler Design and Increased Reliability for Reduced System Costs
For today’s high-power industrial applications, designers have traditionally used discrete components for the IGBT drivers, resulting in higher overall design complexity and increased system costs. To help designers overcome this, Fairchild Semiconductor has launched the FOD8318 Smart Gate Driver Optocoupler with Active Miller Clamp. The device is an advanced 2.5A output current IGBT drive optocoupler capable of driving most 1200V / 150A IGBTs.
2.2A Maximum Output Current, 18V Driver Transistor Built-In Synchronous Step-Down DC/DC Converter XC9248 Series
TOREX SEMICONDUCTOR has developed a 2.2A Maximum output current, 18V Driver Transistor Built-In Synchronous Step-Down DC/DC Converter, the XC9248 series. The XC9248 series are bootstrap-type Nch-Nch drive step-down synchronous DC/DC converters with an internal driver Tr that is capable of 18V operation.
Achronix Ship 22nm Speedster22i HD1000 FPGAs To Customers
Achronix is shipping the industry-leading Speedster22i HD1000 FPGA to customers. Built on Intel’s advanced 22nm, 3-D Tri-Gate transistor technology, Speedster22i HD devices consume half the power and are half the cost of competitive high-end FPGAs for targeted high bandwidth applications. They are the only FPGAs with a full suite of hardened interface IP including 10/40/100G Ethernet, 100Gbps Interlaken, PCI Express Gen1/2/3 and 2.133 Gbps ...
The Industry’s First Mass-Produced SiC MOS Module Without a Schottky Diode
ROHM recently announced that they have begun mass-production of 1200V/180A-rated SiC MOS modules for inverters/converters used for industrial equipment, photovoltaic power conditioners and the like. This new product is the first* module to incorporate a power semiconductor comprised of just an SiC MOSFET, increasing the rated current to 180A for broader applicability while contributing to lower power consumption and greater compactness.
Toppan And Plastic Logic To Develop Market For Large-Area, Flexible EPD Signage And Showcase World’s First 42” Prototype In Japan
TOPPAN Printing Co Ltd and the recognised leader in flexible display technology, Plastic Logic, will together showcase the first large-area, flexible digital signage prototype, based on Plastic Logic’s innovative flexible plastic displays in the TOPPAN booth (number RT1319) at RETAILTECH JAPAN from 5 to 8 March 2013 in Tokyo. This is the first time in the world that a flexible, reflective digital signage module over 40” in size, using organic...
Texas Instruments Gate Drivers Target IGBT And SiC FET Designs
Texas Instruments unveil the industry’s first 35-V, single-channel, output stage power management gate drivers for insulated-gate bipolar transistors and silicon carbide FETs. TI’s new UCC27531 and UCC27532 output stage gate drivers with split output provide the most efficient output drive capability, shortest propagation delay and increased system protection for isolated power designs, such as solar DC/AC inverters, uninterruptible power sup...
imec And Holst Centre Present ULP Processor Operating At Near-Threshold Voltage
At this week’s International Solid State Circuits Conference, imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages. The processor delivers clock speeds up to 1MHz at voltages down to 0.4 V. In tests based on a Fast Fourier Transform use case, it consumed only 79 µW – a fraction of the power consumption at standard voltages.
Renesas Electronics to Release Photocouplers with World-Top-Class High-Speed Switching Operation and Integrated IGBT Protection Function for IGBT Gate Drive
Renesas Electronics today announced two new photocouplers PS9332L and PS9332L2, with an integrated insulated-gate bipolar transistor (IGBT) [Note 1] protection function, for applications such as industrial machinery and solar power systems.
congatec Announce COM Express Entry Modules With Intel Celeron Dual-Core Processors
congatec has announced Intel Celeron Dual-Core processors with 3rd Generation Intel Core technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at a low price point. The modules come with the new mobile Intel HM76 Express Chipset, offers up to 16GB of dual-channel DDR3 memory (1600 MT/s) plus direct support for USB 3.0 and Intel Hyper-Threading ...
STMicroelectronics 28nm FD-SOI Technology Hits 3GHz Operating Speed
STMicroelectronics announced today the achievement of another major milestone in its testing of its 28nm FD-SOI Technology Platform. Following the Company’s December announcement of the successful manufacturing of System on Chip integrated circuits, ST today announced that application-processor engine devices manufactured at the Company’s Crolles, France fab, were capable of operating at 3GHz with even greater power efficiency at a given oper...