Search results for "Synopsys"
IC Validator verifies 12.8Tbps network switch
It has been announced by Synopsys, that Innovium has adopted the Synopsys IC Validator tool for physical signoff. Innovium deployed IC Validator on their flagship 12.8Tbps throughput TERALYNX switch. To meet their aggressive time-to-market schedule, Innovium used IC Validator across more than 250 CPU cores to take advantage of IC Validator's performance scaling.
Updates advance optical design for AR/VR systems
The release of version 2018.12 of the Synopsys RSoft Photonic Component Design Suite, which introduces new features to advance the design of optics used in augmented reality and virtual reality (AR/VR) systems, has been announced by Synopsys. The latest RSoft release supports Synopsys' optical design workflow for nano-textured diffractive optical elements that enable smaller, lightweight AR/VR devices with improved displays and immersive experien...
Accelerate InP-based PIC design and production
It has been announced by Synopsys that, in conjunction with the American Institute for Manufacturing Integrated Photonics (AIM Photonics), Infinera's process design kit (PDK) is now available for Synopsys' OptSim Circuit tool. The addition of the Infinera PDK to OptSim Circuit enables users to schematically capture, simulate, and verify indium phosphide (InP)-based photonic integrated circuit (PIC) designs with Infinera's PDK building blocks.
Synopsys and SMART Photonics Expand InP-Based PIC Design Automation
Synopsys and SMART Photonics announce a new, production-ready process design kit based on SMART Photonics' Indium Phosphide process is now available in Synopsys' OptSim Circuit tool to support InP-based photonic integrated circuit design and simulation. Synopsys' PIC Design Suite, which comprises OptSim Circuit and OptoDesigner tools, provides a seamless PIC design flow from idea to manufacturing from a single solutions provider. The addition of ...
Memory test and repair solution enhanced for embedded MRAM
It has been announced by Synopsys, that the DesignWare STAR Memory System solution now offers new memory built-in self-test (BIST), repair, and diagnostic capabilities for embedded MRAM (eMRAM)-based designs, with initial support for GLOBALFOUNDRIES (GF) eMRAM on the 22FDX process.
Mid-range FPGAs deliver 300K LE and SerDes performance
PolarFire field-programmable gate arrays (FPGAs) from Microsemi are in stock at Mouser Electronics. The flash-based, mid-range FPGAs deliver 300K logic elements at up to 50% lower power consumption than equivalent SRAM-based FPGAs. The devices offer excellent security, single event upset (SEU)-immune fabric, and serializer/deserializer (SerDes) performance for a variety of applications in the communications, defence, aviation, industrial automati...
Bluetooth mesh selected as strategic protocol for smart home solutions
In response to growing adoption of Bluetooth mesh networking in smart home solutions, the Bluetooth Special Interest Group (SIG) has announced the formation of a new Smart Home Subgroup. The announcement follows the decision from a growing number of market leaders to adopt Bluetooth mesh networking as a strategic communications protocol for smart home solutions.
Expertise in emulation being brought to bear
It has been announced that Synopsys was selected by the Defense Advanced Research Projects Agency (DARPA) for the Posh Open Source Hardware (POSH) program to create new innovation in analog mixed signal verification as part of its Electronics Resurgence Initiative (ERI), in partnership with Lockheed Martin and Analog Devices, using Synopsys’ ZeBu emulation technology.
Optimised solutions for Arm-based designs showcased
At Arm TechCon, at the San Jose Convention Center in San Jose, California, October 16th to 18th, Synopsys, will showcase its Synopsys Design Platform, Verification Continuum Platform, and DesignWare IP. Synopsys offers optimised solutions and professional services to accelerate innovation throughout the Arm-based product design flow.
Collaboration delivers design flow for packaging technologies
It has been announced by Synopsys, that the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies. The design platform enablement is combined with the 3D-IC reference flow.