Search results for "Synopsys"

Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.

Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tapeouts.

Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tapeouts.

Synopsys, Inc. announced the industry's first complete PCIe 7.0 IP solution, consisting of a controller, IDE security module, PHY, and verification IP.

Synopsys announces it has entered into a definitive agreement with Clearlake Capital Group, L.P. ("Clearlake") and Francisco Partners, two global private equity firms, for the sale of its Software Integrity Group business in a transaction with a total value of up to $2.1 billion, including up to $475 million in cash payable upon Francisco Partners and Clearlake achieving a specified rate of return in connection with one or more liquidity transact...

Synopsys has announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.

Synopsys has announced that it has completed the acquisition of Intrinsic ID, a provider of Physical Unclonable Function (PUF) IP used in the design of system-on-chips (SoCs).

Synopsys, has announced the launch of ImSym – Imaging System Simulator, a virtual prototyping platform for imaging systems, encompassing lenses, sensors, and image signal processors (ISPs).

In an era dominated by data-intensive AI workloads, Synopsys’ latest offering addresses the critical need for high-bandwidth, low-latency chips capable of processing vast amounts of data swiftly.

Synopsys announces the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology.