Search results for "tsmc"
Cloud hyperscale accelerated with 112G-LR SerDes IP
Cadence Design Systems has unveiled its third-generation 112G long-reach (112G-LR) SerDes IP on TSMC’s N5 process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, and switch fabric systems on chip (SoCs).
Cadence receives TSMC OIP award for N3 collaboration
Cadence Design Systems has announced that it has received a TSMC Open Innovation Platform (OIP) Ecosystem Forum Customers’ Choice award for a paper, ‘Optimised Digital Design, Implementation and Signoff on TSMC’s N3’, which was presented during the TSMC 2020 North America OIP Ecosystem Forum.
Tiempo selects IC'Alps for silicon implementation
Tiempo Secure and IC’Alps have announced a strategic collaboration to widespread silicon implementation of Common Criteria (CC) EAL5+ grade Secure Element cores for IoT applications. Specifically, Tiempo Secure is relying on IC’Alps’ expertise in physical design implementation to develop the hard macro of its Secure Element named TESIC, from netlist to GDSII.
Automotive IC marketshare slips in 2020
In this month’s June Update to The McClean Report, IC Insights has presented its forecast for IC usage by major product type and end-use application (i.e., computer, communications, consumer, automotive, industrial, and government/military) through 2025.
Top five design products in May
Electronic Specifier takes a look at the top five design products released in May.
Stress testing the global electronic components supply network
The responses from commercial organisations and governments following the COVID-19 pandemic and the current levels of vaccination scepticism on the part of our European neighbours has been met with a curious mixture of relief and concern from many people for whom the ultimate outcome could be critical.Even after the UK rollout of the various inoculations many people will still fall ill and some will unfortunately die. This puts the loss of revenu...
Top 5 design products in March
Electronic Specifier takes a look at the top five design products released in March.
Sondrel builds on 7nm design work to offer 5nm
As more and more foundries are offering 5nm, Sondrel has announced that it is supporting them with 5nm design work. This builds on it being one of the few design houses to have taped out a number of 7nm designs.
UltraScale+ for compact, high-performance edge compute
Xilinx has announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70% smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.
Can chiplets maintain the momentum of IC design?
When Rambus was founded 30 years ago, RAM cost $98 per megabyte, and the latest Intel processor, the 80486, had 1.2 million transistors and was fabricated on a 1µm process. In comparison, in September 2020, RAM cost $0.0028 per megabyte, and the latest Nvidia A100 AI processor has 54 billion transistors and is fabricated on a 7nm process. Gary Bronner, Senior Vice President of Rambus Labs, explains more.