Search results for "TSMC"

IC Insights released its August Update to the 2021 McClean Report this month, which includes a review of the top 25 semiconductor sales leaders for 2Q21. The top ten suppliers for 2Q are covered in this research bulletin.

Cadence Design Systems has unveiled its third-generation 112G long-reach (112G-LR) SerDes IP on TSMC’s N5 process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, and switch fabric systems on chip (SoCs).

Cadence Design Systems has announced that it has received a TSMC Open Innovation Platform (OIP) Ecosystem Forum Customers’ Choice award for a paper, ‘Optimised Digital Design, Implementation and Signoff on TSMC’s N3’, which was presented during the TSMC 2020 North America OIP Ecosystem Forum.

Tiempo Secure and IC’Alps have announced a strategic collaboration to widespread silicon implementation of Common Criteria (CC) EAL5+ grade Secure Element cores for IoT applications. Specifically, Tiempo Secure is relying on IC’Alps’ expertise in physical design implementation to develop the hard macro of its Secure Element named TESIC, from netlist to GDSII.

In this month’s June Update to The McClean Report, IC Insights has presented its forecast for IC usage by major product type and end-use application (i.e., computer, communications, consumer, automotive, industrial, and government/military) through 2025.

Electronic Specifier takes a look at the top five design products released in May.

The responses from commercial organisations and governments following the COVID-19 pandemic and the current levels of vaccination scepticism on the part of our European neighbours has been met with a curious mixture of relief and concern from many people for whom the ultimate outcome could be critical.Even after the UK rollout of the various inoculations many people will still fall ill and some will unfortunately die. This puts the loss of revenu...

Electronic Specifier takes a look at the top five design products released in March.

As more and more foundries are offering 5nm, Sondrel has announced that it is supporting them with 5nm design work. This builds on it being one of the few design houses to have taped out a number of 7nm designs.

Xilinx has announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70% smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.