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Siemens Digital Industries Software has announced it has been recognised by TSMC as a recipient of three 2021 OIP Partner of the Year awards.

Siemens Digital Industries Software has announced that ongoing collaboration with longtime foundry partner TSMC has resulted in an array of new product certifications, and that the companies have reached key milestones for cloud-enabled IC design, as well as for TSMC 3DFabric, TSMC’s comprehensive family of 3D silicon stacking and advanced packaging technologies.

To facilitate chip innovation and enable designers to quickly achieve silicon success of complex high-performance computing (HPC) and mobile SoCs,Synopsys,today announced a collaboration with TSMC to develop a broad portfolio of Synopsys DesignWareInterfaceandFoundationIP on the TSMC N4P process.

Siemens Digital Industries Software announced that its mPower solution for power integrity analysis of analogue, digital and mixed-signal IC designs is now certified for TSMC’s N7 and N5 process technologies.

“Apple’s A14 Bionic, fully dedicated to the iPhone12 series and iPads, arrived on the scene in 2020, and this was the right time,” asserts Ying-Wu Liu, Technology & Cost Analyst at System Plus Consulting. “The Apple’s A15 Bionic was not far behind, offering multiple advantages for the iPhone 13 and iPad Mini series,” adds Ying-Wu Liu.

TSMC Recognises Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards

Electronic Specifier takes a look at the top power products to have been released in December.

NXP Semiconductors and TSMC has announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.

Cadence Design Systems has announced that it is expanding its collaboration with TSMC to accelerate mobile, AI and hyperscale computing application design using the integrated Cadence digital flow and custom/analogue tool suite on TSMC’s N3 and N4 process technologies.

Cadence Design Systems has announced immediate availability of Cadence IP supporting the PCI Express (PCIe) 5.0 specification on TSMC N5 process technology. The next follow-on version on TSMC N3 process technology is expected to be taped out in early 2022.